The Boeing Company

Rodney A Juelfs

Gerard V Bohr

Andrew S Roth

Robert E Millen

James P Wallace

Systems and methods for multiple input instrumentation buses are disclosed. In one embodiment, a bus assembly includes a control module adapted to be coupled to a network, and a plurality of nodes operatively coupled in a linear topology. A plurality of interface modules are coupled to the nodes. At least one node is adapted to receive a primary response signal from the correspondingly coupled interface module, and a secondary response signal from at least one other node, and to determine which of the primary and secondary response signals arrived first, and to output a corresponding one of the primary and secondary response signals that arrived first.

Systems and methods for multiple input instrumentation buses

A system remotely collects test data from a test platform using platform attached sensors. Identification chips, each having a unique identification code, are each paired with an associated sensor to form sensor/chip pairs. At least one patch panel having a plurality of connections is positioned approximate to the platform. Connections are communicatively linked to each of the sensor/chip pairs. A computer system is communicatively linked to additional patch panel connections. The identification of selected sensors is queried by a computer command to the patch panels, and a group of sensors for a given test is identified and selected. Test data from each of the selected sensors is transferred through the patch panels to the computer system for collation and generation of a test setup compatible with a data acquisition system. Test setup information is downloaded to the data acquisition system in preparation for the next test.

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Seattle, WA, United States of America

Rodney A Juelfs