The Dexter Corporation

Other

Rocco Papalia

William F Gebhardt

An apparatus and method for producing substantially clear ice in a variety of desired shapes. The apparatus and method in the described embodiments generally provide for an insulated ice mold containing one or more mold cells, each mold cell with an open top, open bottom, and insulated side walls, that is suspended over a liquid water reservoir surrounded and contained in an insulated container. The top surface of the water residing in each mold cell is exposed to freezing air. The insulated walls forming the sides of one or more mold cells act to insure that each ice shape forms and grows from the top surface, down and towards the bottom of each mold cell. The liquid water reservoir, which contacts the bottom surface of the ice shape, remains in a liquid phase and serves as an impurity sink into which the impurities and gases contained in the freezing water are driven as ice forms downward in the mold cell. The liquid water reservoir acts to arrest ice growth below the bottom of the mold cell, while the water in the mold cells freezes into a solid above the ice-water interface.

Transparent ice maker

A thin film printed board precursor containing a laminate of a dielectric thermosetting resin film layer and a heat and electrically conductive metal foil layer in direct adhesive bonding with a side of the resin film, optionally containing a supporting layer comprising one or more of fiber, fabric and thermoplastic polymer in contact with the other side of the resin layer, wherein the dielectric thermosetting resin layer has an unimpeded thickness that is at least equal to that of the foil layer bonded to it.

Conductive film composite

A method for making a thin film printed board precursor containing a laminate of a controlled-flow dielectric thermosetting resin film layer and a heat and electrically conductive metal foil layer in direct adhesive bonding with a side of the resin film, optionally containing a supporting layer comprising one or more of fiber, fabric and thermoplastic polymer in contact with the other side of the resin layer, wherein the dielectric thermosetting resin layer has an unimpeded thickness that is at least equal to that of the foil layer bonded to it. The method comprises adhesively bonding an electrically conductive metal foil layer to a dielectric thermosetting resin film layer that has said unimpeded thickness. The laminate may be debossed through the metal foil layer and into the dielectric thermosetting resin film layer with a tool containing a raised electrical circuit pattern thereon. This step involves impressing the tool onto the foil layer surface thereby causing the foil layer to impress into the unimpeded thickness of the thermosetting resin layer and retaining one or more of a debossed and embossed pattern in the metal foil and the attached resin film that is complementary to the raised electrical circuit pattern on the tool. The debossed laminate is subjected to conditions that effect one of near-gelation, gelation and cure of the attached resin film and fixes the retained pattern in the metal foil layer and the resin layer of the laminate.

Method for making a conductive film composite

A thin thermosetting resin film that is amenable to being subjected to a debossing procedure that debosses a grooved printed circuit pattern thereon with minimal loss of debossment precision of the grooved pattern, which pattern and the grooving can be cured to produce a thermoset resin film that can be employed for eventually generating a printed board. The thermosetting resin film has the following qualities:

Debossable films

Processing of materials and their combination to produce a thin foil-laminated adhesive dielectric thermosetting resin film and the conversion of it by a mechanical debossing procedure to impart a debossed and/or embossed printed circuit pattern directly thereon. A process for compositing a shaped metal foil containing a debossed electrical circuitry pattern and an thin isotropic uncured and ungelled thermosetting resin film and forming an adhesively joined composite conforming essentially to the shape of the predebossed metal foil. The process comprises placing a shaping tool with a surface possessing an embossed electrical circuitry pattern, as described in the prior art, and forcing the shaped surface and a surface of the metal foil into intimate contact to deform the metal foil to assume essentially the shape of the tool surface. The shaped metal foil is separated from contact with the tool surface. The separated metal foil is placed in contact with a thin isotropic uncured and ungelled thermosetting resin film. It is forced into the film without significantly altering its shape. This causes the film to deform and assume the shape of the foil. The condition associated with the film in contact with the foil are such that the film assumes a set condition and the foil is adhesively bonded to the film.

Growing community of inventors

Antioch, CA, United States of America

Rocco Papalia