Stats Chippac Pte. Ltd.

Chippac, Inc.

Robinson Quiazon

Sheila Marie L Alvarez

Hin Hwa Goh

Il Kwon Shim

Jose Alvin Caparas

Frederick Rodriguez Dahilig

Geun Sik Kim

Jae Soo Lee

Jeffrey David Punzalan

Antonio Bambalan Dimaano, Jr

Sheila Alvarez

Erick Dahilig

A flip chip lead frame package includes a die and a lead frame having a die paddle and leads, and has a spacer to maintain a separation between the die and the die paddle. Also, methods for making the package are disclosed.

Semiconductor flip chip package having substantially non-collapsible spacer and method of manufacture thereof

Semiconductor flip chip package having substantially non-collapsible spacer

An integrated circuit encapsulation system with vent is provided including providing a sheet material, forming a leadframe array on the sheet material, forming a leadframe air vent on the leadframe array, attaching an integrated circuit to the leadframe array, mounting the leadframe array in a mold and encapsulating the integrated circuit and the leadframe array.

Integrated circuit encapsulation system with vent

An integrated circuit package system includes an integrated circuit package having a downset terminal lead, a planar recessed lead surface of the downset terminal lead, and an attached integrated circuit over the planar recessed lead surface.

Integrated circuit package system with downset lead

The present invention provides an etched leadframe flipchip package system comprising forming a leadframe comprises forming contact leads and etching a plurality of multiple dotted grooves on the contact leads, and attaching a flipchip integrated circuit having solder interconnects on the contact leads between each of the plurality of the multiple dotted grooves.

Etched leadframe flipchip package system

Growing community of inventors

Singapore, Singapore

Robinson Quiazon