Adc Telecommunications, Inc.

Robin L Berg, Jr

Steven W Skradde

Derek Sayres

Todd Frederick Husom

Brian J McClellan

John Anderson

Eric K Sit

Gary Lee Steinkogler

David J Streitz

Eric Comer

Joseph Czyscon

Timothy John Kjolsing

Dale C Madsen

Steven N Skradde

A telecommunications equipment mounting assembly is disclosed herein. The assembly includes a housing adapted for holding telecommunications equipment such as an optical-to-electrical and electrical-to-optical converter modules. The telecommunications equipment mounting assembly also includes an adapter plate removably connected to the housing. The adapted plate includes structure for managing both fiber optic and copper cable.

Housing for telecommunications equipment

A telecommunications chassis, module, and repeater circuit for use with signals having data rates including STM-1 (155.52 megabits per second) are disclosed. The chassis provides structures for establishing shielding and heat dissipation for the circuitry modules it contains including an outer and an inner Faraday box with an integrated ventilation pattern for circulating air. The module provides its own structures for establishing shielding and heat dissipation including a Faraday box and a ventilation pattern. The repeater circuit provides the ability to bridge a data signal between a monitor jack of one device and a higher signal level input jack of another device through multiple amplification stages and circuit board structures. The telecommunications chassis, module, and repeater circuit can be used in conjunction.

Telecommunications chassis, module, and bridging repeater circuitry

Telecommunications chassis and associated modules for use with the telecommunications chassis are disclosed. Embodiments of the telecommunications chassis include structures such as horizontal channels and/or horizontal surfaces with ridges and/or slots in one surface and slots in ridges of another for receiving edges of modules that mount within the chassis. Other structures of embodiments include divider slots in the horizontal surfaces that receive edges of divider walls to fix the divider walls in place, heat baffle surfaces included within the chassis, and/or cable guides with radius limiters. Module embodiments include structures such as faceplates with angled portions with fiber optic cable connections directed toward the fiber cable's direction of travel. Other module structures include shells that enclose the circuit board and/or provide angled portions with fiber optic cable connections. Module embodiments may also include circuitry for converting electrical signals to optical and optical signals to electrical, and the circuitry may selectively operate at multiple data rates.

Telecommunications chassis and module

A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation and flame containment features while accommodating a high density of the circuitry cards. Embodiments include an inner housing with a double-layer middle floor dividing the chassis into top and bottom chambers. Each layer has partially aligned slots, and an air gap is provided between the two layers. Embodiments also include a double-layer mesh cover with an air gap existing between the two mesh layers. Projections and grooves are provided on the inner surfaces of the inner housing to receive circuit cards having a guide on one edge and a fin on another. The circuit card includes conductor structures such as multiple board layers with paired and segregated conductors. The circuit card also includes some components positioned to cooperate with the ventilation features of the chassis and includes some components chosen for low-power consumption or reduced flammability.

Telecommunications chassis and card

A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation and flame containment features while accommodating a high density of the circuitry cards. Embodiments include an inner housing with a double-layer middle floor dividing the chassis into top and bottom chambers. Each layer has partially aligned slots, and an air gap is provided between the two layers. Embodiments also include a double-layer mesh cover with an air gap existing between the two mesh layers. Projections and grooves are provided on the inner surfaces of the inner housing to receive circuit cards having a guide on one edge and a fin on another. The guide includes an opening that at least partially aligns with slots on the adjacent surface of the inner housing. The circuit card includes a finger extending from a faceplate that facilitates insertion and removal of the circuit card relative to the chassis.

Telecommunications chassis and card with flame spread containment

Growing community of inventors

Shakopee, MN, United States of America

Robin L Berg, Jr