Redpoint Thermalloy Limited

Robin D Johnson

Francis Edward Fisher

David G Gove

Michael D Wade

William D Jordan

Heatsink devices are formed by attaching a plurality of fin members to a planar base member. A primary strip of thermally conducive material forms base members which are assembled with fin members formed from a secondary sheet of thermally conducting material. Each fin member is secured to a respective portion of the primary strip. The primary strip is advanced with the fin members secured thereto to be parted off to provide the heatsink devices. The synchronization of the forming of fins with the assembly reduces manual input to the manufacturing process, negates the need to hold stocks of preformed fins and increases design freedom with respect to dimensions of the heatsinks being formed.

Method and an apparatus for manufacturing heatsink devices

A process for forming a profiled element from a generally longitudinally extending extruded sheet-form member having a plurality of transversely spaced longitudinally extended ribs upstanding therefrom is provided. The process includes the step of removing longitudinally spaced apart portions from some of said ribs by means of a transversely acting punching means.

Apparatus for forming a profiled element

A process for forming a profiled element from a generally longitudinally extending extruded sheet-form member having a plurality of transversely spaced longitudinally extended ribs upstanding therefrom is provided. The process includes the step of removing longitudinally spaced apart portions from some of the ribs by means of a transversely acting punching means.

Heat sink

Process for forming a profiled element

A sheet metal device for mounting a component on a circuit board is formed by stamping to defining a head portion and a base portion. The head portion is formed for insertion into a slot in a component such as a heat sink and the base portion is formed for insertion into a printed circuit board. The head portion has spade-form members which engage the walls of the slot and retain the head portion in the slot. The component is mounted on a printed circuit board by inserting the base portion into an aperture in the printed circuit board and soldering the base portion to the reverse surface of the board.

Growing community of inventors

Bath, United Kingdom

Robin D Johnson