Seagate Technology Incorporated

Robin Andrew Davies

Joachim Walter Ahner

David Marcus Tung

Ian J Beresford

Thomas Larson Greenberg

Daniel T Jennings

Weilu Hang Xu

Wei Xu

Antonio Javier Zambano

Stan Kassela

Lim Boon Leong

Clay Harrison Heberly

Liu Hao Jun

Chun Wai Tong

A non-metallic media substrate includes a disc-shaped substrate body having at least one media storage surface on a face thereof. The substrate body has a center opening having an inner diameter and an outer diameter surface, and the substrate body has a thickness. The substrate further includes an annular groove at the outer diameter of the media substrate, the annular groove having chamfered edges and an internal concavity extending toward the inner diameter.

Method of laser cutting a hard disk drive substrate for an edge profile alignable to a registration support

An apparatus includes a beam splitter and a plurality of mirrors. The beam splitter is positioned to receive a laser beam from a source and split the received laser beam to a first plurality of split laser beams and a second plurality of split laser beams. The plurality of mirrors is configured to direct the first plurality of split laser beams and further configured to direct the second plurality of split laser beams. The first plurality of split laser beams is directed by the plurality of mirrors is configured to cut a glass substrate. The second plurality of split laser beams is directed by the plurality of mirrors is configured to shape the glass substrate.

Laser beam cutting/shaping a glass substrate

A method includes projecting energy onto an annular edge of a glass substrate. The annular edge includes a first roughness. The first roughness is reduced to a second roughness with the energy. The energy reduces the first roughness without changing a roundness of the annular edge of the glass substrate.

Edge polishing a glass substrate after cutting

A sputtering apparatus includes a sputtering cathode and a target overlying the sputtering cathode. A shield overlies the target and forms an aperture configured to direct sputtering particles onto a substrate. The shield includes a lower shield portion overlying the target, a channel outlet overlying the lower shield portion, and an upper shield portion overlying the channel. In some embodiments the shield includes a first shield and a second shield. The first shield includes a front gas injection outlet. The second shield overlies the first shield and forms the aperture. In various embodiments, the second shield is operable to adjust plasma confinement between the first shield and the second shield.

Sputtering shield

Growing community of inventors

Livermore, CA, United States of America

Robin Andrew Davies