Ams International Ag

Robertus Antonius Maria Wolters

Roel Daamen

Casper Juffermans

Josephus Franciscus Antonius Maria Guelen

Disclosed is an integrated circuit (IC) comprising a substrate () carrying a plurality of circuit elements; a metallization stack () interconnecting said circuit elements, said metallization stack comprising a patterned upper metallization layer comprising at least one sensor electrode portion () and a bond pad portion (), at least the at least one sensor electrode portion of said patterned upper metallization layer being covered by a moisture barrier film (); a passivation stack () covering the metallization stack, said passivation stack comprising a first trench () exposing the at least one sensor electrode portion and a second trench () exposing the bond pad portion; said first trench being filled with a sensor active material (). A method of manufacturing such an IC is also disclosed.

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Eindhoven, Netherlands

Robertus Antonius Maria Wolters