United States of America as Represented by the Secretary of the Air Force

Other

Roberto S Aga

Emily M Heckman

Jeffrey P Massman

Fahima Ouchen

Jack P Lombardi, Iii

Carrie M Bartsch

A multi-junction resistance strain gauge comprises a substrate; a sinterable ink deposited directly on the substrate forming a non-conductive pattern; a stripe pattern generated on the sinterable ink by sintering, the stripe pattern having one or more non-conductive gaps, the stripe pattern having a first electrical conductivity; a sintered bridge across each of the one or more gaps and providing electrical continuity through the stripe and across the gaps, each bridge having a second electrical conductivity which is lower than the first electrical conductivity. The substrate is a non-conductive material or a conductive material coated with a thin insulator on which the stripe pattern is generated. The sinterable ink is a silver ink. The first electrical conductivity and the second electrical conductivity comprise different electrical conductivity. The first electrical conductivity of the stripe is a factor of about 1.7 or more higher than the second electrical conductivity of the bridge.

Multi-junction resistance strain gauge design for enhanced gauge factor

Various deficiencies in the prior art are addressed by systems, methods, architectures, mechanisms and/or apparatus configured for fabricating a strain sensing device directly on a structure by printing or otherwise depositing a material on the structure, the material exhibiting a piezo-resistive effect, and sintering a strain sensing pattern from the material such that the strain sensing pattern becomes electrically conductive.

System and method for fabricating a strain sensing device directly on a structure

A method for making an antenna comprises creating a digital antenna file defining dimensional characteristics of a radiating support structure and a ground support structure; uploading the digital antenna file to an additive-manufacturing device; manufacturing the radiating support structure and ground support structure with the additive-manufacturing device; coating one side of the radiating support structure and ground support structure with a conductive ink; attaching the radiating support structure and ground support structure together; fixing a radio frequency connector to the conductive ink on the radiating support structure and the ground support structure. The radiating support structure and the ground support structure are attached together with a dielectric adhesive. The radio frequency connector is a coaxial cable; its center conductor is connected to the conductive coating of the radiating support structure and its outer conductor is connected to the conductive coating of the ground support structure using a conductive adhesive.

Additively-manufactured omnidirectional antenna

A printed circuit board (PCB) comprises two or more PCB layers comprising of a dielectric core and conductive cladding on adjoining surfaces; one or more DC lines embedded in one or more layers of the two or more PCB layers; one or more RF signal lines embedded in one or more layers of the two or more PCB layers; wherein the one or more DC lines crosses over/under at least one of the RF signal lines to form at least one crossover, wherein the at least one crossover is no thicker than the PCB layer in which it is situated. The printed circuit board of claim, further comprising two or more generally parallel DC lines which converge to form a stack of superposed parallel DC lines where the two or more DC lines cross over the one or more RF signal lines.

Fabrication of electrical and/or optical crossover signal lines through direct write deposition techniques

Various deficiencies in the prior art are addressed by systems, methods, architectures, mechanisms and/or apparatus configured for fabricating a strain sensing device directly on a structure by printing a material on the structure, the material exhibiting a piezo-resistive effect, and sintering a strain sensing pattern from the material such that the strain sensing pattern becomes electrically conductive.

A variable capacitor includes a first metal layer. The variable capacitor further includes a deoxyribonucleic acid-based (DNA-based) biopolymer layer including an organic component and a surfactant. The DNA-based biopolymer layer is adjacent the first metal layer. The variable capacitor further includes a conjugated polymer layer adjacent the DNA-based biopolymer layer and a second metal layer adjacent the conjugated polymer layer.

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Beavercreek, OH, United States of America

Roberto S Aga