Juniper Networks, Inc.

Openlight Photonics, Inc.

Opnext Subsystems, Inc.

Airwave Technology, Inc.

Roberto Marcoccia

Theodore John Schmidt

Christian Malouin

George R Sosnowski

Bo Zhang

Steven William Keck

Pradeep S Sindhu

Murat Arabaci

Robert Silvio Guzzon

Sean P Woyciehowsky

Gunes Aybay

Gregory Alan Fish

James Michael Murphy

Brian Robert Koch

Jayabharat Boddu

Abhijit Kumar Choudhury

Philip A Thomas

Anand Ramaswamy

John M Garcia

Christopher Paul Wyland

Valery Kugel

Sudharsanan Srinivasan

Elias Simpson

Steve McGowan

Michael Maietta

Benjamin M Curtin

Ross Alexander Saunders

Robert Pompeani

Charles McEwan

George Sosnowski

Sean-Paul Woyciehowsky

Described herein is a die-to-wafer bonding process that utilizes micro-transfer printing to transfer die from a source wafer onto an intermediate handle wafer. The resulting intermediate handle wafer structure can then be bonded die-down onto the target wafer, followed by removal of only the intermediate handle wafer, leaving the die in place bonded to the target wafer.

Die-to-wafer bonding utilizing micro-transfer printing

An optical pick and place machine that includes a self-calibrating optical controller for error feedback based optical placement of optical components using active alignment is described. The optical controller can include a loopback mode to generate a baseline value of light generated by a light source and measured by a photodetector within the optical controller. The optical controller can further include an active alignment mode in which the light is coupled from the pick and place machine to the optical device on which the component is placed. The optical coupling of the placed component can be evaluated against the baseline value to ensure that the optical coupling is within specification (e.g., within a prespecified range).

Optical based placement of an optical component using a pick and place machine

Photonic and electronic integrated circuits can be cooled using variable conductance heat pipes containing a non-condensable gas in addition to a phase-changing working fluid. To package the heat pipe with a subassembly including the integrated circuits in a standard housing providing a heat sink contact area, the heat pipe is oriented, in some embodiments, with its axis between evaporator and condenser ends substantially perpendicular to the direction along which the integrated circuit subassembly is separated from the heat sink contact area, and a portion of the exterior surface of the heat pipe is thermally insulated, with a suitable thermal insulation structure, from the heat sink contact area.

Thermal management with variable conductance heat pipe

An optical transceiver can be calibrated using an internal receiver side eye scan generator, and calibration values (e.g., modulator values) can be stored in memory for recalibration of the optical transceiver. The eye scan generator can receive data from the transmitter portion via an integrated and reconfigurable loopback path. At a later time, different calibration values can be accessed in memory and used to recalibrate the optical transceiver or update the calibrated values using the receive-side eye scan generator operating in loopback mode.

Optical transceiver loopback eye scans

Optical based placement of an optical compontent using a pick and place machine

A microcontroller can interact with external ASICs using a multi-serial peripheral interface. The ASICs and the microcontroller can be included in an electrical device or an optical-electrical device. The microcontroller can implement the interface to access the registers of the different ASICs in bulk interactions, including a bulk status request, bulk configuration setting, and bulk data reads.

Mapped register access by microcontrollers

In some embodiments, an apparatus includes an automatic integrated circuit (IC) handler having a change kit. The change kit has a plunger moveably disposable onto an automatic test equipment (ATE). In such embodiments, the ATE is configured to receive an integrated circuit having an optical interface. The plunger has a first position and a second position. In such embodiments, the plunger is out of contact with the integrated circuit when the plunger is in the first position. The plunger includes an optical connector operatively coupled to the optical interface of the integrated circuit when the plunger is in the second position.

Methods and apparatus for optical transceiver calibration and test

In some embodiments, an apparatus includes an optical transmitter module that can be electrically coupled to an electrical serializer/deserializer and a controller. The optical transmitter module can include an electrical detector that can receive an in-band signal. The electrical detector can send to the controller a first power error signal and a second power error signal based on the in-band signal. The controller can send a correction control signal to the electrical serializer/deserializer based on the first power error signal and the second power error signal such that the electrical serializer/deserializer sends a pre-emphasized signal to the optical transmitter module based on the correction control signal. In such embodiments, the first power error signal, the second power signal and the correction control signal are out-of-band signals.

Method and apparatus for distortion correction in optical communication links

An article may include an optical transceiver package, which may include a photonics component mounted in the optical transceiver package. The photonics component may generate heat in an operational state. The optical transceiver package may include a sealed thermal chamber that maintains the photonics component between a lower predetermined working temperature and a higher predetermined working temperature. The sealed thermal chamber may include a material that exhibits a first thermal conductivity below a lower predetermined threshold temperature and a second thermal conductivity higher than the first thermal conductivity above an upper predetermined threshold temperature. A method may include retaining the generated heat to raise the photonics component above a lower predetermined working temperature, and conducting the generated heat away from the optical transceiver package to lower the photonics component below an upper predetermined working temperature. A system may include the optical transceiver package mounted to a printed circuit board.

Optical transceiver package with passive thermal management

In some embodiments, a system includes a set of servers, a set of switches within a switch fabric, and an optical device. The optical device is operatively coupled to the set of servers via a first set of optical fibers. Each server from the set of servers is associated with at least one wavelength from a set of wavelengths upon connection to the optical device. The optical device is operatively coupled to each switch from a set of switches via an optical fiber from a second set of optical fibers. The optical device, when operative, wavelength demultiplexes optical signals received from each switch from the set of switches, and sends, for each wavelength from the set of wavelengths, optical signals for that wavelength to the server from the set of servers.

Methods and apparatus for a flattened data center network employing wavelength-agnostic endpoints

In some embodiments, an apparatus includes a first optical transceiver. The first optical transceiver includes a set of optical transmitters, an optical multiplexer operatively coupled to the set of optical transmitters, and a variable optical attenuator operatively coupled to the optical multiplexer. The variable optical attenuator is configured to receive a control signal from a controller of the first optical transceiver and modulate a signal representing control information with an output from the optical multiplexer. The control information is associated with the control signal and for a second optical transceiver operatively coupled to the first optical transceiver.

Methods and apparatus for remote management of an optical transceiver system

Growing community of inventors

San Jose, CA, United States of America

Roberto Marcoccia