Avanex Corporation

Oclaro Technology Limited

Lumentum Technology UK Limited

Oclaro (north America Inc.)

Oclaro Inc.

Corning O.t.i. S.r.l.

Roberto Galeotti

Mario Bonazzoli

Luigi Gobbi

Nicola Rettani

Mark Andrew Shaw

Giacomo Coppo

An RF transition assembly () for enabling a radiofrequency transition between an RF transmission layer () of an electronic device and a conductor () which is electrically connected () to the RF transmission layer (). The conductor () extends generally orthogonal to the RF transmission layer (). The assembly comprises an open coaxial structure () located adjacent to an edge of the RF transmission layer (). The open coaxial structure () comprises a cavity () extending therethrough for receiving the conductor (). The cavity () comprises an opening facing the edge of the RF transmission layer () so as to direct electromagnetic radiation towards the RF transmission layer ().

RF transition assembly comprising an open coaxial structure with a cavity for receiving a conductor that is coupled orthogonal to an RF transmission layer

There is described an optoelectronic device having a housing and a chip housed by the housing. At least a portion of the chip protrudes through an aperture in a wall of the housing. There is further provided an optoelectronic module comprising such an optoelectronic device and electronic control circuitry adapted to control the operation of the optoelectronic device.

Reduced length optoelectronic devices

A package design for electro-optic devices has been developed in which the substrate supporting the electro-optic element serves also as the base of the device housing. The electro-optic element is flip-chip bonded to the substrate. In a preferred embodiment the substrate is a multi-level wiring board.

Electro-optic device packages

The present invention generally relates to an air cavity plastic package for a high frequency optical device. In one aspect, a module package for a high frequency optoelectronic device is provided. The module package includes an upper plastic housing having an upper cavity formed therein and a lower plastic housing having a lower cavity formed therein. The upper housing and the lower housing are configured to mate together such that the cavities form an enclosed air cavity between the housings. Additionally, upon creating a seal between the housings, an optical feed through is realized. The module package further includes a plurality of conductors disposed in the lower housing, each conductor having an upper end and a lower end, wherein the upper end is connectable to a chip disposed in the air cavity and the lower end is connectable to a board. In another aspect, a method of packaging and assembling a high frequency optical device is provided. In yet another aspect, a package assembly for an electro-optical modulator is provided.

Air cavity plastic package for high frequency optical devices

The invention relates to an optical assembly for opto-electronic packages comprising an optical fibre secured on the underside of an elongated support member in optical alignment with an opto-electronic device, wherein said support member is affixed to an aligning member, which in turn is affixed, e.g., by laser welding, to a welding platform. In a preferred embodiment, the elongated support member is a planar parallelepiped. In a further preferred embodiment, the elongated support member is a parallelepiped with an axially extended slot, in which the optical fibre is secured with its longitudinal axis substantially parallel to the axially extended slot.

Growing community of inventors

Giussago, Italy

Roberto Galeotti