Technoprobe S.p.a.

Roberto Crippa

Raffaele Vallauri

Flavio Maggioni

Giuseppe Crippa

Stefano Felici

Riccardo Vettori

Riccardo Liberini

Daniele Perego

Filippo Dell'Orto

Stefano Lazzari

Andrea Calaon

Emanuele Bertarelli

Guiseppe Crippa

A contact element for a probe head for an electronic device test apparatus is disclosed, having a body extending along a longitudinal axis between a first and a second opposite contact end, each made of electrically conductive material. The body includes a first section which extends over a distance less than 1000 μm along the longitudinal axis starting from the first contact end towards the second contact end, a second section which extends along the longitudinal axis starting from the second contact end towards the first contact end, and a third section, interposed between the first and second sections, made of an electrically insulating material. The sections follow each other along the longitudinal axis so that the first contact end is included only in the first section, the second contact end is included only in the second section, and the third section electrically insulates the first section from the second section.

Contact element for a probe head for testing high-frequency electronic devices and relating probe head

A testing head for testing the functionality of an electronic device is disclosed having a plurality of contact probes including a probe body extended between respective end portions adapted to contact respective contact pads, a lower guide provided with guide holes for housing the contact probes, and a conductive portion in the lower guide. The conductive portion includes a group of the guide holes and is adapted to contact and short-circuit a corresponding group of contact probes housed in the group of holes. The contact probes housed in the group of holes include a deformable portion adapted to be partially inserted into the guide holes of the group. The deformable portion, when housed in the guide holes, is in a configuration in which it is deformed by the contact with a wall of the guide holes and exerts on the wall a reaction force ensuring a sliding contact during testing of the electronic device.

Testing head with an improved contact between contact probes and guide holes

A probe head for a test equipment of electronic devices comprises a plurality of contact probes inserted in guide holes provided in at least one upper guide and one lower guide, a bending area for the contact probes being defined between the upper and lower guides, each contact probe having at least one first terminal portion which protrudes of a first length from the lower guide and ends with a contact tip (A) adapted to abut onto a respective contact pad of a device to be tested, as well as a second terminal portion which protrudes of a second length from the upper guide and ends with a contact head adapted to abut onto a contact pad of a board for connecting or interfacing with the test equipment, suitably comprising at least one protection structure projecting from the upper guide in direction of a longitudinal development axis of the contact probes towards the board, the protection structure thus extending in correspondence of the contact heads of the contact probes.

Probe head for electronic devices and corresponding probe card

A method of manufacturing a multi-layer for a probe card comprises providing first contact pads on an exposed face of a first dielectric layer and second contact pads on an exposed face of a last dielectric layer. Each dielectric layer is laser ablated to realize pass-through structures and the pass-through structures are conductively filled to realize conductive structures. The dielectric layers are superimposed in a way that each conductive structure contacts a corresponding conductive structure of a contiguous dielectric layer in the multi-layer and forms conductive paths electrically connected the first and second contact pads. The second contact pads having a greater distance between its symmetry centers than the first contact pads, the multi-layer thus performing a spatial transformation between the first and second contact pads connected through the connective paths.

Manufacturing method of a multi-layer for a probe card

A probe head for a testing apparatus integrated on a semiconductor wafer is disclosed having a first plurality of contact probes having a first transversal diameter, a second plurality of micro contact probes having a second transversal diameter, smaller than the first transversal diameter, and a flexible membrane having conductive tracks for connecting a first plurality contact probe with a corresponding second plurality micro contact probe. The second plurality contact probes are arranged between the testing apparatus and the flexible membrane, and the second plurality micro contact probes are arranged between the flexible membrane and a semiconductor wafer. The second plurality micro contact probes are configured to abut onto contact pads of a device under test integrated in the semiconductor wafer, with each first plurality contact probe being in contact with a corresponding second plurality micro contact probe through a conductive track of the flexible membrane to connect the device under test with the testing apparatus.

Probe head for reduced-pitch applications

A testing head comprises a plurality of contact probes, and a guide having a plurality of guide holes for housing the contact probes and including a conductive portion. Each contact probe includes a first end region and a second end region, and a body which extends between the first and second end regions. Suitably, the conductive portion includes a group of the guide holes and electrically connects contact probes of a first group of the contact probes. The contact probes of the first group slide in the guide holes in the conductive portion and are adapted to carry a same signal, and each contact probe of a second group of the plurality of contact probes is surrounded by an insulating coating layer that extends along the body of each contact probe of the second group, thereby insulating the contact probes of the second group from the conductive portion.

Testing head with improved frequency property

A contact probe comprises a probe body being extended in a longitudinal direction between respective end portions adapted to realize a contact with respective contact pads, at least one end portion having transverse dimensions greater than the probe body. Suitably, the end portion comprises at least one indentation adapted to house a material scrap being on the contact probe after a separation from a substrate wherein the contact probe has been realized.

Contact probe and relative probe head of an apparatus for testing electronic devices

A contact probe for a testing head of an apparatus for testing electronic devices comprises a body extending along a longitudinal axis between a first end portion and a second end portion, the second end portion being adapted to contact pads of a device under test. Suitably, the contact probe comprises a first section, which extends along the longitudinal axis from the first end portion and is made of an electrically non-conductive material, and a second section, which extends along the longitudinal axis from the second end portion up to the first section, the second section being electrically conductive and extending over a distance less than 1000 &#x3bc;m.

Contact probe for a testing head for testing high-frequency devices

An interface element () for a testing apparatus of electronic devices comprises at least one support () provided with a plurality of through-openings () that house respective interconnections elements (), which extend between a first end () and a second end (). Suitably, the interconnections elements () are made of a conductive elastomer that fills the openings () of the support (), each of the interconnection elements () forming a conductive channel between different and opposing faces (Fa, Fb) of the support ().

Interface element for a testing apparatus of electronic devices and corresponding manufacturing method

A testing head comprises at least one guide provided with a plurality of guide holes, and a plurality of contact elements housed in the plurality of guide holes. Suitably, the at least one guide comprises a plurality of conductive layers, each conductive layer: including holes of a corresponding plurality of group of the plurality of guide holes and electrically connecting a corresponding group of contact elements housed in the guide holes of the group, contact elements of a group being adapted to carry a same type of signal. The at least one guide is a multilayer comprising a plurality of non-conductive layers, and the conductive layers are arranged on respective faces of a layer of the plurality of non-conductive layers.

Vertical probe testing head with improved frequency properties

A probe card for testing of electronic devices comprises a testing head with plural contact probes inserted into guide holes of an upper guide and a lower guide, and a space transformer, each of the contact probes having a first terminal portion projecting from the lower guide with a first length and ending with a contact tip adapted to abut onto a respective contact pad of a device to be tested, and a second terminal portion projecting from the upper guide with a second length and ending with a contact head adapted to abut onto a contact pad of the space transformer. The probe card comprises a spacer element interposed between the space transformer and the upper guide and removable to adjust the first length of the first terminal portion by changing the second length of the second terminal portion and approaching the upper guide and the space transformer.

Probe card for electronics devices

A testing head for testing a device includes a couple of plate-like supports separated from each other by a suitable gap and provided with respective guide holes to slidably house a plurality of contact probes, each including a rod-like body extending along a preset longitudinal axis between a first and second ends, the first end being a contact tip that abuts a contact pad of the device and the second end being a contact head that abuts a contact pad of a space transformer. At least one of the supports comprises a couple of guides that are parallel to each other and separated by an additional gap and provided with corresponding guide holes. Each contact probe comprises a protruding element or stopper originating from a lateral wall and realized in correspondence of one wall of a guide hole of the guides contacting the lateral wall of the contact probe.

Testing head comprising vertical probes

A manufacturing method of a semi-finished product that includes a plurality of contact for a testing head of electronic devices comprises the steps of: providing a substrate made of a conductive material; and defining each contact probe by removing material from the substrate, each contact probes being anchored to the substrate by at least one bridge of material. The step of defining the contact probes includes a step of laser cutting, in correspondence with a contour of the contact probes and of that at least one bridge of material.

Manufacturing method of a semi-finished product comprising a plurality of contact probes for a testing head of electronic devices and related semi-finished product

A contact probe of a testing head of a testing apparatus of electronic devices comprises respective end portions adapted to contact respective contact pads and a body essentially extended in a longitudinal direction between the end portions, at least one end portion comprising an insert made of a first conductive material having a hardness being greater than a second conductive material making the contact probe which is supported by a section of the end portion, the section being made of the second conductive material and being shaped in a complementary way with respect to the insert and having respective abutting surfaces facing and adhering to respective abutting surfaces of the insert.

Growing community of inventors

Cernusco Lombardone, Italy

Roberto Crippa