Hewlett-packard Development Company, L.P.

Oregon State University

Hewlett-packard Company

Roberto A Pugliese

James Elmer Abbott, Jr

Greg Scott Long

Jeffrey Allen Nielsen

Ronald L Enck

Mark H MacKenzie

Douglas A Keszler

Christie Dudenhoefer

Daniel A Kearl

Martha A Truninger

Colin C Davis

Victor Joseph

John F Wager, Iii

Victorio Chavarria

Debora J Thomas

Thomas E Pettit

Ronnie Yenchik

Ravi Ramaswami

Allen H Smith

Steven P Storm

John M McGlone

Kristopher Olsen

Zhizhang Chen

Mohammed Saad Shaarawi

Craig Olbrich

Stephen Horvath

Michael W Cumbie

Rio Rivas

Naoto A Kawamura

Alfred I-Tsung Pan

Tony S Cruz-Uribe

Diane R Hammerstad

Michael D Miller

Arun K Agarwal

Kenneth Ward

Ed Friesen

Matthew David Smith

Sadiq Bengali

Mehrgan Khavari

Timothy R Emery

Satya Prakash

Michael B Hager

Shen Buswell

Michael J Day

Susanne L Kumpf

James E Abbott

Kathryn H Cyr

Erica Midttveit Squires

Samuel Ajayi

William F Stickle

Jr James Elmer Abbott

A microfluidic dispenser can include a processor to receive a user input via a user interface related to limiting dilution (or a limiting dilution assay) to be performed, and calculate a dispense volume of a fluid for the limiting dilution based on the user input. The microfluidic dispenser can also include a dispense cassette including a fluid reservoir, and a microfluidic dispense head to dispense the fluid via a nozzle in accordance with the calculated dispense volume.

Microfluidic dispensers for limiting dilution

In one example in accordance with the present disclosure, a fluid ejection system is described. The fluid ejection system includes a frame to retain a number of fluid ejection devices. Each fluid ejection device includes a reservoir disposed on a first side of the frame and a fluid ejection die disposed on an opposite side of the frame. Each fluid ejection die includes 1) a fluid feed slot formed in a substrate to receive fluid from the reservoir, 2) an array of nozzles formed in the substrate to eject fluid, and 3) an ejection adjustment system to selectively adjust an amount of fluid ejected from the fluid ejection devices.

Fluid ejection with ejection adjustments

In one example in accordance with the present disclosure, a fluidic die is described. The fluidic die includes a plurality of ejection subassemblies. Each ejection subassembly includes an ejection chamber to hold a volume of fluid and an opening through which the volume of fluid is ejected via a fluid actuator. A pitch of the ejection subassemblies aligns with a spatial arrangement of nanowells in an array of nanowells on a substrate.

Ejection subassembly pitches to match nanowell spacing

An alignment system, in an example, may include a substrate comprising at least one nanowell, at least one fluid ejection device comprising at least one die, the at least one die comprising as least one nozzle, and an alignment device to align the at least one nozzle to the at least one nanowell.

Alignment devices

An amorphous thin metal film can comprise a combination of three metals or metalloids including: 5 at % to 90 at % of a metalloid selected from the group of carbon, silicon, and boron; 5 at % to 90 at % of a first metal selected from the group of titanium, vanadium, chromium, iron, cobalt, nickel, zirconium, niobium, molybdenum, ruthenium, rhodium, palladium, hafnium, tantalum, tungsten, osmium, iridium, and platinum; and 1 at % to 90 at % of cerium. The three elements may account for at least 50 at % of the amorphous thin metal film.

Amorphous thin metal film

A wear resistant coating may comprise an amorphous metal comprising at least one refractory metal, at least two elements selected from periods 4, 5, 6, 9, and 10, and a metalloid. An amorphous metal may comprise at least one refractory metal, at least two elements selected from periods 4, 5, 6, 9, and 10, and a metalloid. A coating may comprise at least one refractory metal, at least two elements selected from periods 4, 5, 6, 9, and 10, and silicon. In some examples, the amorphous metal is TaWSi. In one example, the refractory metals may comprise Niobium, Molybdenum, Tantalum, Tungsten, Rhenium, or combinations thereof.

Wear resistant coating

In one example, a printhead structure includes an ejector element, a multi-layer insulator covering the ejector element, and an amorphous metal on the insulator.

Printhead structure

An amorphous thin metal film can include a combination of metals or metalloids including: 5 at % to 74 at % of a metalloid selected from the group of carbon, silicon, and boron; 5 at % to 74 at % of a first metal; 5 at % to 74 at % of a second metal; and 5 at % to 70 at % of a dopant. The first and second metals can be independently selected from the group of titanium, vanadium, chromium, iron, cobalt, nickel, zirconium, niobium, molybdenum, ruthenium, rhodium, palladium, hafnium, tantalum, tungsten, osmium, iridium, or platinum, wherein the first metal and the second metal can be different metals. The dopant can be selected from the group of oxygen, nitrogen, or combinations thereof. The metalloid, first metal, second metal, and dopant can account for at least 70 at % of the amorphous thin metal film.

In one example, a liquid ejection device. The device includes a first metal layer over a substrate, a dielectric layer over the first metal layer, and an orifice through the dielectric layer to the first metal layer. The device also includes a second metal layer over the dielectric layer and partially filling the orifice to form a via to electrical connect the two metal layers. The via has a depth-to-width ratio of at least 0.4. The device further includes a passivation stack covering the second metal layer including all interior surfaces of the via. The stack includes an ALD-deposited layer formed by atomic layer deposition.

Atomic layer deposition passivation for via

The present disclosure is drawn to a thermal inkjet printhead stack with an amorphous thin metal protective layer, comprising an insulated substrate, a resistor applied to the insulated substrate, a resistor passivation layer applied to the resistor, and an amorphous thin metal protective layer applied to the resistor passivation layer. The amorphous thin metal protective layer can comprise from 5 atomic % to 90 atomic % of a metalloid of carbon, silicon, or boron. The film can also include a first and second metal, each comprising from 5 atomic % to 90 atomic % of titanium, vanadium, chromium, cobalt, nickel, zirconium, niobium, molybdenum, rhodium, palladium, hafnium, tantalum, tungsten, iridium, or platinum. The second metal is different than the first metal, and the metalloid, the first metal, and the second metal account for at least 70 atomic % of the amorphous thin metal protective layer.

Thermal inkjet printhead stack with amorphous thin metal protective layer

The present disclosure is drawn to a thermal inkjet printhead stack with an amorphous metal resistor, including an insulated substrate and a resistor applied to the insulated substrate. The resistor can include from 5 atomic % to 90 atomic % of a metalloid of carbon, silicon, or boron; and from 5 atomic % to 90 atomic % each of a first and second metal of titanium, vanadium, chromium, cobalt, nickel, zirconium, niobium, molybdenum, rhodium, palladium, hafnium, tantalum, tungsten, iridium, or platinum, where the second metal is different than the first metal. The metalloid, the first metal, and the second metal can account for at least 70 atomic % of the amorphous thin metal film.

Thermal inkjet printhead stack with amorphous metal resistor

In an embodiment, a method of fabricating a fluid ejection device includes forming a resistor on the front side of a substrate, depositing a dielectric film on the resistor to protect the resistor from chemical exposure during a slot formation process, and forming a slot in the substrate that extends from the back side to the front side of the substrate.

Protecting a fluid ejection device resistor

A fluid ejection device includes a thin film heater resistor portion having a heater resistor, and a two-layer structure disposed over the heater resistor. The two-layer structure includes a top layer and a bottom layer, with the top layer having a hardness that is at least 1.5 times greater than the hardness of the bottom layer.

Fluid ejection device

A method of forming a slotted substrate that includes patterning a thin film over a substrate so that at least a portion of the substrate within a slot region is not covered by the thin film. In addition, a slot is formed in the substrate through the slot region that extends through the substrate and the thin film, wherein a chip count in a shelf surrounding the slot is minimized when the slot is formed in the substrate through the thin film in the slot region.

Method of forming a slotted substrate with partially patterned layers

Growing community of inventors

Tangent, OR, United States of America

Roberto A Pugliese