Everlight Electronics Co., Ltd.

Robert Yeh

Yi-Tsuo Wu

Tsung-Yuan Chen

Ke-Hao Pan

Bo-Yu Chen

Hung-Hsiang Yeh

A light-emitting device, including a mount substrate, at least one light emitting element, a first light transparent member, a second light transparent member and a covering member, is disclosed. The at least one light emitting element is disposed on the mount substrate in a flip-chip manner. The first light transparent member is configured to receive the incident light emitting from the light emitting element, wherein the first light transparent member is formed of an inorganic substance and an inorganic phosphor, and includes a top surface and a first side surface contiguous to the top surface. The second light transparent member is disposed on the top surface of the first light transparent member and is formed of the inorganic substance and contains no the inorganic phosphor, and includes an externally exposed light emission surface and a second side surface contiguous to the externally exposed light emission surface. The covering member comprises a light reflective material and covers at least the first side surface of the first light transparent member and at least the second side surface of the second light transparent member.

Light-emitting device

Various examples of a light emitting diode (LED) package structure and a manufacturing method thereof are described. In one aspect, a LED package structure includes a carrier, a LED chip, a first annular barricade, a second annular barricade and a fluorescent encapsulant. The LED chip is electrically connected to the carrier. The first annular barricade and the second annular barricade are disposed around the LED chip, with the second annular barricade disposed between the LED chip and the first annular barricade. The fluorescent encapsulant is disposed on the carrier and at least covers the LED chip and the second annular barricade. The fluorescent encapsulant includes at least a type of phosphor and at least a type of gel with the phosphor distributed over a surface of the LED chip.

Light emitting diode package structure and manufacturing method thereof

The present disclosure provides a flip chip type light emitting diode which comprises a substrate and a light emitting diode chip. The substrate comprises a body, a plurality of third pads, a fourth pad, a first electrode, a second electrode, a plurality of first vias, and a second via. The body has a first surface and a second surface opposite to the first surface. The third pads and the fourth pad are disposed on the first surface of the body. The first electrode and the second electrode are disposed on the second surface of the body. The first vias traverse through the body and are each electrically coupled to a respective one of the third pads and the first electrode. The second via traverses through the body and is electrically coupled to the fourth pad and the second electrode.

Flip chip type light emitting diode and manufacturing method thereof

Light emitting diode

An LED backlight module includes a substrate. An LED array, composed of a plurality of red, blue and green lamp LEDs, is mounted on the substrate. A light-mixing chamber is mounted on the substrate and is used to seal the LED array inside. A diffusion sheet is secured inside the light-mixing chamber and is disposed parallel to the substrate. A first prism sheet is secured inside the light-mixing chamber and is disposed parallel to the diffusion sheet. A second prism sheet is secured inside the light-mixing chamber and is disposed parallel to the first prism sheet.

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Taipei, Taiwan

Robert Yeh