Hrl Laboratories, LLC

Hughes Electronics Corporation

Hughes Aircraft Company

Other

Raytheon Company

University of California

Rosemount Aerospace Limited

Robert Y Loo

Tsung-Yuan Hsu

Adele E Schmitz

James H Schaffner

Juan F Lam

Daniel J Hyman

Jar Jar Lee

Julia J Brown

Greg Tangonan

Daniel Frederic Sievenpiper

Stan W Livingston

Jonathan James Lynch

Gregory L Tangonan

Robert N Schwartz

Brett Warneke

Debabani Choudhury

Lap-Wai Chow

Willie W Ng

G Sanjiv Kamath

Paul Ouyang

James A Foschaar

Darren E Atkinson

Ronald C Knechtli

Daniel Yap

David T Chang

Robert A Rosen

Mehran Mehregany

Robin J Harvey

Kapriel V Krikorian

Joseph L Pikulski

Robert R Hayes

Ming C Wu

Irwin L Newberg

Franklin A Dolezal

Shin-Tson Wu

Pyong K Park

Robert S Miles

Jae Lee

Vince L Jones

A micro-electro-mechanical switch is described. The switch comprises a substrate, with a signal transmission portion and an activation portion attached with the substrate. The activation portion includes an armature activation electrode positioned above a substrate activation electrode. The signal transmission portion includes a metal contact extending from a conducting transmission line and through a bottom insulating layer of the signal transmission portion, thereby being exposed for electrical contact. A mechanical linkage connects the activation portion with the signal transmission portion so that the activation portion and the signal transmission portion move in concert. When an activation signal is applied along the activation portion, both the activation portion and the signal transmission portion are drawn toward the substrate to a substantially closed position, where the metal contact of the signal transmission portion electrically contacts a signal transmission electrode.

Micro-electro-mechanical switch

A micro-electromechanical system (MEMS) switch formed on a substrate, the switch comprising a transmission line formed on the substrate, a substrate electrostatic plate formed on the substrate, and an actuating portion. The actuating portion comprises a cantilever anchor formed on the substrate and a cantilevered actuator arm extending from the cantilever anchor. Attraction of the actuator arm toward the substrate brings an electrical contact into engagement with the portions of the transmission line separated by a gap, thus bridging the transmission line gap and closing the circuit. In order to maximize electrical isolation between the transmission line and the electrical contact in an OFF-state while maintaining a low actuation voltage, the actuator arm is bent such that the minimum separation distance between the transmission line and the electrical contact is equal to or greater than the maximum separation distance between the substrate electrostatic plate and arm electrostatic plate.

Stress bimorph MEMS switches and methods of making same

A reconfigurable wide band phased array antenna for generating multiple antenna beams for multiple transmit and receive functions. The antenna array comprises multiple long non-resonant TEM slot antenna apertures with RF MEMS switches disposed within the slots. The RF MEMS switches are positioned directly within the feed lines across the slots to directly control the coupling of RF energy to the slots. Multiple RF MEMS switches are used within each slot, which allows multiple transmit/receive functions and/or multiple frequencies to be supported by each slot. The frequency coverage provided by the slot antenna has a greater than 10:1 frequency range.

Phased array antenna

A broadband multiple input, multiple output switch matrix. The switch matrix comprises multiple crosspoint switch element tiles. Each tile comprises RF MEMS switches disposed on a substrate to provide a crosspoint switching capability. The crosspoint switch element tiles are disposed in a flip-chip manner on the upper side of an RF substrate that provides RF connectivity between the various crosspoint switch element tiles. A bias line substrate disposed on the lower side of the RF substrate receives control signals for the crosspoint switch element tiles and routes the signals through the RF substrate using vias in the RF substrate.

RF MEMS switch matrix

A torsion spring for an electro-mechanical switch is presented. The torsion spring comprises a set of tines including at least one tine extending from the free end of the armature of a switch. A terminus portion is rotatably suspended between the tines, and includes a conducting transmission line, at least a portion of which is exposed for electrical contact. The conducting transmission line has a length selected such that the exposed portion of the transmission line forms a circuit between the input and output of the micro-electro-mechanical switch when the micro-electro-mechanical switch is urged into a closed position, with the terminus portion rotating via the tines to form a conformal connection between the exposed portion of the conducting transmission line and the input and output of the switch, thus optimizing the electrical flow therebetween. The switch is also applied to MEMS devices.

Torsion spring for electro-mechanical switches and a cantilever-type RF micro-electromechanical switch incorporating the torsion spring

An optically controlled micro-electromechanical (MEM) switch is described which desirably utilizes photoconductive properties of a semiconductive substrate upon which MEM switches are fabricated. In one embodiment the bias voltage provided for actuation of the switch is altered by illuminating an optoelectric portion of the switch to deactivate the switch. In an alternative embodiment, a photovoltaic device provides voltage to actuate the switch without any bias lines at all. Due to the hysteresis of the electromechanical switching as a function of applied voltage, only modest variation of voltage applied to the switch is necessary to cause the switch to open or close sharply under optical control.

Optically controlled MEM switches

A flexible antenna array comprises a plurality of layers of thin metal and a flexible insulating medium arranged as a sandwich of layers. Each layer of the sandwich is patterned as needed to define: (i) antenna segments patterned in one of the metal layers, (ii) an array of metallic top elements formed in a layer spaced from the the antenna segments, the array of metallic top elements being patterned in another metal layer, (iii) a metallic ground plane formed in a layer spaced from the array of metallic top elements, the metallic ground plane having been formed from still another metal layer, and (iv) inductive elements coupling each of the top elements in the array of metallic top elements with said ground plan. An array of remotely controlled switches are provided for coupling selected ones of said antenna segments together.

Low-cost HDMI-D packaging technique for integrating an efficient reconfigurable antenna array with RF MEMS switches and a high impedance surface

A microelectromechanical (MEM) switch is fabricated inexpensively by using processing steps which are standard for fabricating multiple metal layer integrated circuits, such as CMOS. The exact steps may be adjusted to be compatible with the process of a particular foundry, resulting in a device which is both low cost and readily integrable with other circuits. The processing steps include making contacts for the MEM switch from metal plugs which are ordinarily used as vias to connect metal layers which are separated by a dielectric layer. Such contact vias are formed on either side of a sacrificial metallization area, and then the interconnect metallization is removed from between the contact vias, leaving them separated. Dielectric surrounding the contacts is etched back so that they protrude toward each other. Thus, when the contacts are moved toward each other by actuating the MEM switch, they connect firmly without obstruction. Tungsten is typically used to form vias in CMOS processes, and it makes an excellent contact material, but other via metals may also be employed as contacts. Interconnect metallization may be employed for other structural and interconnect needs of the MEM switch, and is preferably standard for the foundry and process used. Various metals and dielectric materials may be used to create the switches, but in a preferred embodiment the interconnect metal layers are aluminum and the dielectric material is SiO , materials which are fully compatible with standard four-layer CMOS fabrication processes.

CMOS-compatible MEM switches and method of making

A method and apparatus for comparing a force to a signal, or comparing two signals, through mechanical movement of capacitive plates in a transducer. The transducer plates are separated by d, which in one embodiment is preferably a linear function of a pressure or force F. In that embodiment, application of a signal i(t&plus;&tgr;) to the plates will cause a voltage representing a correlation between F and i to appear between the plates. In another embodiment, instead of an external mechanical force or pressure, an electrical signal V related to a signal S may drive the transducer plates to achieve a voltage indicating a correlation between S and the signal input i(t&plus;&tgr;). Transducers to practice the invention may be microelectromechanical devices fabricated using integrated circuit techniques to permit small size and low cost.

Microelectromechanical correlation device and method

A tuneable impedance surface for steering and/or focusing a radio frequency beam. The tunable surface comprises a ground plane; a plurality of elements disposed a distance from the ground plane, the distance being less than a wavelength of the radio frequency beam; and a capacitor arrangement for controllably varying the capacitance of at least selected ones of adjacent elements. A method of tuning the high impedance surface allows the surface to mimic, for example, a parabolic reflector or a diffraction grating.

Tunable impedance surface

A tuneable impedance surface for steering and/or focusing a radio frequency beam. The tunable surface comprises a ground plane; a first plurality of elements disposed in an array a first distance from the ground plane, the distance being less than a wavelength of the radio frequency beam; and a second plurality of elements disposed in an array a second distance from the ground plane, the second plurality of elements be moveable relative to the first plurality of elements.

Method and apparatus for actuating switches in a reconfigurable antenna array. Micro electro-mechanical system (MEMS) switches span gaps between antenna elements disposed on an antenna substrate. An integrated optic waveguide network which directs optical energy towards the MEMS switches is contained in a superstrate disposed above the antenna elements and substrate. The MEMS switches are formed on a semi-insulating substrate. When illuminated, the resistance of the semi-insulating substrate is lowered so as the reduce the resistance between the control contacts. The antenna array is reconfigured by directing optical energy to the photo-voltaic cells connected to selected MEMS switches to close those MEMS switches, thereby electrically connecting selected antenna elements and by directing optical energy to the semi-insulating substrate of selected MEMS switches to open those MEMS switches, thereby electrically disconnecting selected antenna elements.

Optical network for actuation of switches in a reconfigurable antenna

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Agoura Hills, CA, United States of America

Robert Y Loo