Montage Technology Co., Ltd.

Montage Electronics (shanghai) Co., Ltd.

Montage Technology (kunshan) Co., Ltd.

Robert Xi Jin

Lizhi Jin

Leechung Yiu

Yibo Jiang

Christopher Cox

Leonard Datus

Gang Yan

Zheng Qiu

The present application provides a memory device. The memory device includes a connector plate having a front edge and a rear edge opposite to the front edge, wherein the connector plate comprises an edge connector disposed at the rear edge and configured to connect to a host connector of a host device; a controller plate defining a first connection region, a second connection region and a chip region, wherein the controller plate is attached to the connector plate at the first connection region, and the controller plate comprises a memory control module disposed in the chip region and in electrical communication with the edge connector; and at least one memory module detachably connected to the controller plate at the second connection region of the controller plate, wherein each of the at least one memory module is in electrical communication with the memory control module when the memory module is connected to the controller plate, such that the memory module can be accessible by the host device via the memory control module.

Modular memory devices

A memory device with modular design and the memory system comprising the same is disclosed. The memory device comprises a substrate plate having a front edge, a rear edge opposite to the front edge, and a top side and a bottom side which are opposite to each other and extend between the front edge and the rear edge; an edge connector positioned at the rear edge and configured to connect to a host connector of a host device; a memory control module positioned on one of the top side and the bottom side of the substrate plate; at least one socket positioned on the top side of the substrate plate and configured to connect to at least one removable memory module; and wherein the memory controller module is electrically coupled to the edge connector and the at least one socket such that the at least one memory module can be accessible by the host device via the memory control module.

Memory device with modular design and memory system comprising the same

An apparatus for controlling access to a memory device comprising rows of memory units is provided. The apparatus comprises: an operation monitor configured to track memory operations to the rows of memory units of the memory device; a row hammer counter configured to determining, for each of the rows of memory units, row hammer effects experienced by the row of memory units due to the memory operations to the other rows of memory units of the memory device; a mitigation module configured to initiate, for each of the rows of memory units, row hammer mitigation in case that accumulated row hammer effects experienced by the row of memory units reach a predetermined threshold; and a virtual host module configured to perform the row hammer mitigation targeting a row of memory units in response to the initiation of row hammer mitigation for the row of memory units by the mitigation module.

Apparatus for controlling access to a memory device and memory system comprising the same

A memory system, comprising: a first plurality of memory ranks each having multiple memory cells; a second plurality of local controllers each coupled between one or more of the first plurality of memory ranks and a memory controller, the memory controller being configured to provide to a target local controller of the second plurality of local controllers, out of a first plurality of chip select (CS) signals, a target access CS signal enabling target access to a target memory rank of the first plurality of memory ranks coupled to the target local controller, and provide to the second plurality of local controllers, later than the target access CS signal, a command and address (CA) signal for addressing and accessing the multiple memory cells of the target memory rank; and wherein the target local controller is configured to generate, in response to receiving the target access CS signal, a target CA on-die termination (ODT) instruction switching on target CA ODT at its CA input at least for a period when the CA signal is being received from the memory controller.

On-die termination control for memory systems

A memory system, comprising: a first plurality of memory ranks each having multiple memory cells; a second plurality of local controllers each coupled between one or more of the first plurality of memory ranks and a memory controller, the memory controller being configured to provide to a non-target local controller of the second plurality of local controllers, out of a first plurality of chip select (CS) signals, one or more non-target access CS signals disabling target access to one or more non-target memory ranks of the first plurality of memory ranks coupled to the non-target local controller; and the memory controller being further configured to provide to a target local controller of the second plurality of local controllers, out of the first plurality of CS signals, a target access CS signal enabling target access to a target memory rank of the first plurality of memory ranks coupled to the target local controller, and provide to the second plurality of local controllers a command and address (CA) signal for addressing and accessing the multiple memory cells of the target memory rank; and wherein the non-target local controller is configured to provide to the non-target memory ranks, in response to receiving the one or more non-target access CS signals, one or more composite on-die termination (ODT) instructions which instruct respective ones of the one or more non-target memory ranks to selectively switch on non-target DQ/DQS ODT for a data communication bus coupled between the first plurality of memory ranks and the memory controller at least for a period when the memory controller is performing target access to the target memory rank; wherein each composite ODT instruction comprises a combination of secondary CS instruction(s) and a secondary CA instruction.

Growing community of inventors

San Jose, CA, United States of America

Robert Xi Jin