Lexmark International, Inc.

Other

Funai Electric Company Ltd.

Robert Wilson Cornell

Yimin Guan

James Harold Powers

Byron Vencent Bell

Frank Edward Anderson

George Keith Parish

Lawrence Russell Steward

Steven Robert Komplin

Shirish Padmaker Mulay

Robert Lee Cornell

Bruce David Gibson

Scott Michael Heydinger

Michael John Dixon

Curtis Ray Droege

Bryan McKinley

Elios Klemo

Jack William Morris

Robert L Cornell

Gary Allen Denton

William Paul Cook

Ashok Murthy

Carl Edmond Sullivan

Edmund Hulin James, Iii

John Philip Bolash

Ann P Holloway

Kent Lee Ubellacker

Gina Marie Johns

Richard Louis Goin

Burton Lee Joyner, Ii

Neal Douglas McFarland

Daniel L Huber

Nicholas Jon Post

Paul Albert Cook

Jamee Casteel Holiway

David Steven Waldrop

Burton L Joyner, Ii

Jancy Bonewits

Chad Young

Shirish Padamakar Mulay

James Harold Power

A consumable supply item for an imaging device holds an initial or refillable volume of pigmented ink. Its housing defines an interior and exterior. The interior retains the ink and an exit port supplies it to an imaging device. Users orient the housing to deplete the ink in a direction of gravity toward a bottom surface of the interior en route to the exit port. The ink passes through a mixing chamber having inlet ports arranged to restrict to multiple different heights the entrance of the volume of ink from the interior. As ink draws from various heights into the chamber, sediments in the pigment mix together. The design overcomes settling. It also avoids mechanical stirring and other complex mixing techniques. Further embodiments include chamber shapes, configuration of inlet ports, and construction of the supply item, to name a few.

Fluid container having mixing chambers for micro-fluid applications

A micro-fluid ejection device structure and method therefor having improved low energy design. The devices include a semiconductor substrate and an insulating layer deposited on the semiconductor substrate. A plurality of heater resistors are formed on the insulating layer from a resistive layer selected from the group consisting of TaAl, Ta2N, TaAl(O,N), TaAlSi, Ti(N,O), WSi(O,N), TaAlN, and TaAl/TaAlN. A sacrificial layer selected from an oxidizable metal and having a thickness ranging from about 500 to about 5000 Angstroms is deposited on the plurality of heater resistors. Electrodes are formed on the sacrificial layer from a first metal conductive layer to provide anode and cathode connections to the plurality of heater resistors. The sacrificial layer is oxidized in a plasma oxidation process to provide a fluid contact layer on the plurality of heater resistors.

Low ejection energy micro-fluid ejection heads

An aqueous-based UV-curable fluid composition for use in a micro-fluid ejection device. The fluid composition includes a mixture of poly-functional compounds, a colorant compound, a photo-initiator and less than about 50 weight percent water based on a total weight of the fluid composition, wherein the fluid composition is substantially devoid of volatile organic carrier fluids.

UV-curable coatings and methods for applying UV-curable coatings using thermal micro-fluid ejection heads

Methods for fabricating micro-fluid ejection heads and micro-fluid ejection heads are provided herein, such as those that use non-conventional substrates. One such micro-fluid ejection head includes a substrate having first and second glass layers disposed adjacent to a surface thereof and a plurality of fluid ejection actuators disposed adjacent to the second glass layer. The first glass layer is thicker than the second glass layer and the second glass layer has a surface roughness of no greater than about 75 &#x212b; Ra.

Micro-fluid ejection heads with multiple glass layers

A process for making a fluid ejector head for a micro-fluid ejection device. In one embodiment, the process comprises depositing a thin film resistive layer on a substrate to provide a plurality of thin film heaters. The thin film resistive layer comprises a tantalum-aluminum-nitride material consisting essentially of AlN, TaN, and TaAl alloys, and containing from about 30 to about 70 atomic % tantalum, from about 10 to about 40 atomic % aluminum and from about 5 to about 30 atomic % nitrogen.

Method for making a thin film resistor

Micro-fluid ejection heads and methods for extending the life of micro-fluid ejection heads. One such micro-fluid ejection head includes a substrate having a plurality of thermal ejection actuators. Each of the thermal ejection actuators has a resistive layer and a protective layer thereon. A flow feature member is adjacent the substrate and defines a fluid feed channel, a fluid chamber associated with at least one of the actuators and in flow communication with the fluid feed channel, and a nozzle. The nozzle is offset to a side of the chamber opposite the feed channel. A polymeric layer having a degradation temperature of less than about 400&#xb0; C. overlaps a portion of the at least one actuator associated with the fluid chamber and positioned less than about five microns from at least an edge of the at least one actuator opposite the fluid feed channel.

Low energy, long life micro-fluid ejection device

A micro-fluid ejection device structure and method therefor having improved low energy design. The devices includes a semiconductor substrate and an insulating layer deposited on the semiconductor substrate. A plurality of heater resistors are formed on the insulating layer from a resistive layer selected from the group consisting of TaAl, Ta2N, TaAl(O,N), TaAlSi, Ti(N,O), WSi(O,N), TaAlN, and TaAl/TaAlN. A sacrificial layer selected from an oxidizable metal and having a thickness ranging from about 500 to about 5000 Angstroms is deposited on the plurality of heater resistors. Electrodes are formed on the sacrificial layer from a first metal conductive layer to provide anode and cathode connections to the plurality of heater resistors. The sacrificial layer is oxidized in a plasma oxidation process to provide a fluid contact layer on the plurality of heater resistors.

A substantially planar fluid ejection actuator and methods for manufacturing substantially planar fluid ejection actuators for micro-fluid ejection heads. One such fluid ejection actuator includes a conductive layer adjacent to a substrate that is configured to define an anode segment spaced apart from a cathode segment. A thermal barrier segment is disposed between the anode and cathode segments. A substantially planar surface is defined by the anode segment, and the thermal barrier segment. A resistive layer is applied adjacent to the substantially planar surface.

Substantially planar ejection actuators and methods relating thereto

Electronic devices, such as those having a flexible substrate and printed material on the flexible substrate. In one embodiment, the printed material and substrate are part of an electronic device having at least three terminals, wherein the electronic device has a charge carrier mobility of at least 10 cm/V-s. Multi-terminal devices can have a substrate including a doped semiconductor layer and at least two doped regions formed upon the substrate. The doped regions can be doped oppositely from the semiconductor layer and exhibit a charge carrier mobility of greater than 10 cm/V-s. Methods for making the same are also disclosed.

Electronic devices and methods for forming the same

A heater chip has a plurality of heaters each having a length, width and thickness. The length multiplied by the width (heater area) is in a range from about 50 to about 500 micrometers squared while the thickness is in a range from about 500 to about 5000 or 6000 angstroms. The energy required to jet or emit a single drop of ink from the heater during use is in a range from about 0.007 to about 0.99 or 1.19 microjoules. The heater chip is formed as a plurality of thin film layers on a substrate. Energy ranges are taught for all heaters having an area from about 50 to about 4000 micrometers squared and thicknesses ranging from about 500 to about 16,000 angstroms. Printheads containing the heater chip and printers containing the printheads are also disclosed.

Heater chip configuration for an inkjet printhead and printer

The present disclosure is directed to a micro-fluid ejection head for a micro-fluid ejection device. The head includes a semiconductor substrate, a fluid ejection actuator supported by the semiconductor substrate, a nozzle member containing nozzle holes attached to the substrate for expelling droplets of fluid from one or more nozzle holes in the nozzle member upon activation of the ejection actuator. The substrate further includes a thermal insulating barrier layer between the semiconductor substrate and the fluid ejection actuator. The thermal insulating barrier layer includes a porous, substantially impermeable material having a thermal conductivity of less than about 1 W/m-K.

Reduction of heat loss in micro-fluid ejection devices

Growing community of inventors

Lexington, KY, United States of America

Robert Wilson Cornell