Superconducting Core Technologies, Inc.

Robert William Schwartz

Husam N Al-Shareef

Duane B Dimos

David Galt

Carl H Mueller

Mark Victor Raymond

The present invention is directed to a method for forming dielectric thin films having substantially reduced electrical losses at microwave and millimeter wave frequencies relative to conventional dielectric thin films. The reduction in losses is realized by dramatically increasing the grain sizes of the dielectric films, thereby minimizing intergranular scattering of the microwave signal due to grain boundaries and point defects. The increase in grain size is realized by heating the film to a temperature at which the grains experience regrowth. The grain size of the films can be further increased by first depositing the films with an excess of one of the compoents, such that a highly mobile grain boundary phase is formed.

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Albuquerque, NM, United States of America

Robert William Schwartz