Infineon Technologies Ag

Robert Wiesner

Robert Strenz

Wolfram Langheinrich

Mayk Roehrich

Hans-Joachim Schulze

Andreas Peter Meiser

Franz Hofmann

Peter Irsigler

Georg Tempel

Jan Otterstedt

Mihail Jefremow

Sebastian Schmidt

Glenn Ashley Farrall

Oliver Hellmund

Christian Peters

Wolf Allers

Klaus Oberlaender

Simon Brewerton

Antonio Vilela

Neil Stuart Hastie

Donald Dibra

Martina Seider-Schmidt

Paul Hubbert

Alfred Eder

In accordance with an embodiment of an integrated circuit, a cavity is buried in a semiconductor body below a first surface of the semiconductor body. An active area portion of the semiconductor body is arranged between the first surface and the cavity. The integrated circuit further includes a trench isolation structure configured to provide a lateral electric isolation of the active area portion.

Isolation of semiconductor device with buried cavity

In an embodiment of the invention, a memory cell arrangement includes a substrate and at least one memory cell including a charge storing memory cell structure and a select structure. The memory cell arrangement further includes a first doping well, a second doping well and a third doping well arranged within the substrate, wherein the charge storing memory cell structure is arranged in or above the first doping well, the first doping well is arranged within the second doping well, and the second doping well is arranged within the third doping well. The memory cell arrangement further includes a control circuit coupled with the memory cell and configured to control the memory cell such that the charge storing memory cell structure is programmed or erased by charging or discharging the charge storing memory cell structure via at least the first doping well.

Memory cell arrangement, method for controlling a memory cell, memory array and electronic device

A memory cell is provided, the memory cell including a first two-terminal memory element; a second two-terminal memory element; a controller circuit configured to program the first two-terminal memory element to one or more states and the second two-terminal memory element to one or more states, wherein a state of the first two-terminal memory element and a state of the second two-terminal memory element are interdependent; and a measuring circuit configured to measure a difference signal between a first two-terminal memory element signal associated with the state of the first two-terminal memory element and a second two-terminal memory element signal associated with the state of the second two-terminal memory element.

Memory cell, a method for forming a memory cell, and a method for operating a memory cell

The disclosed invention provides a structure and method for detecting address line (e.g., wordline, bitline) memory failures. In one embodiment, the method and structure comprise generating an address signature, by re-encoding an internally generated address signal from activated elements (e.g., wordlines) inside a memory array. The regenerated address signature may be compared with a requested memory address location. If the regenerated address signature and memory location are equal than there is no error in the memory array, but if the regenerated address signature and memory location are equal than an error is present in the memory array. Accordingly, re-encoding an address signature provides a closed loop check that a wordline and/or bitline, that was actually activated in a memory array, was the correct requested wordline and/or bitline, that no other wordlines or bitlines were also triggered, and that the wordline and/or bitline is continuous.

Safe memory storage by internal operation verification

In the course of a method for fabricating a field-effect transistor having a floating gate, a structure is formed which has uncovered sidewalls of a layer made of the material for forming the floating gate and which is exposed to an oxidizing atmosphere in order to coat the sidewalls. At the same time, other regions of the structure have an insulating oxide layer. At a point in time prior to the action of an oxidizing atmosphere, nitrogen is implanted into the material of the floating gate in a quantity that appreciably reduces the oxidation at the sidewalls thereof.

Method for fabricating a field-effect transistor having a floating gate

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Bad Aibling, Germany

Robert Wiesner