Dell Products Inc.

Dell USA L.p.

Robert Warren Johnson

James Don Curlee

Lawrence Alan Kyle

Shawn Joel Dube

Richard L Eddings, Ii

Shawn Paul Hoss

Robert Boyd Curtis

Jason Alan Shepherd

Andrew Lafayette McAnally

Daniel S Carr

Stephen T Cook

An equipment rack that includes a modular compute chassis, a modular processing unit located in the modular compute chassis and where the modular processing unit is configured to remove from the front of the modular compute chassis in a frontward direction, relative to the front side of the modular compute chassis, and an air mover unit located in the modular processing unit and where the air mover unit is configured to remove from a rear side of the modular processing unit in a rearward direction, relative to the front side of modular compute chassis.

Modular removable air mover for dual access

Methods and systems for connecting interchangeable input/output (I/O) modules having individual and shared personalities may include a generic I/O bay of a server hosting one or more compute nodes configured to be connected to one or more removable I/O modules. A first connector coupled to a first I/O module may connect the first I/O module to a compute node having a second connector. The first I/O module may be oriented about a first axis. The compute node may be oriented about a second axis. The first connector and the second connector may be capable of being connected in a plurality of orientations. In one embodiment the second axis may be orthogonal to the first axis, and the removable I/O modules may include shared I/O modules. In an embodiment the second axis may be parallel to the first axis, and the removable I/O modules may include individual I/O modules.

Interchangeable I/O modules with individual and shared personalities

A chassis includes a front and back portion. The front portion includes a plurality of compute devices and a first plurality of fans. The back portion includes a plurality of input/output devices and a second plurality of fans. A first airflow zone extends from the front portion to the back portion, the first airflow zone to direct a first airflow from the compute device to the second fans. A second airflow zone extends from the front portion to the back portion, the second airflow zone to provide a second airflow from the first fans to the input/output devices, and to isolate the second airflow from the first airflow zone.

Server chassis with independent orthogonal airflow layout

A chassis includes a compute device and a liquid cooling enablement module. The compute device includes a processor, a cold plate, and first cold and hot liquid lines. The first cold liquid line directs cool liquid from a first cold liquid interconnect of the compute device to the cold plate. The first hot liquid line directs heated liquid from the cold plate to a first hot liquid interconnect of the compute device. The liquid cooling enablement module is a modular self-contained component, and includes a second cold liquid interconnect, and a second hot liquid interconnect. The second cold liquid interconnect directs the liquid from the liquid cooling enablement module to the first cold liquid line via the first cold liquid interconnect. The second hot liquid interconnect directs the liquid from the first hot liquid line to the liquid cooling enablement module via the first hot liquid interconnect.

Server chassis with a liquid cooling enablement module in an input/output module bay

In a component loading system, a circuit board may include a socket, a first plurality of holes, and a second plurality of holes. A frame may include two opposing sidewalls each substantially perpendicular to a surface of the circuit board and coupled to one another via a plate, a plurality of threaded channels, each channel adjacent to one of the two opposing sidewalls and located between the two opposing sidewalls, and a third plurality of holes. A backing plate may include a plurality of heat dissipater mounting posts and a fourth plurality of holes. A plurality of second fasteners may each be mechanically engaged to a respective one of the plurality of threaded channels and passing through a respective one of the second plurality of holes to mechanically secure the frame and backplate on opposite sides of the circuit board.

Systems and methods for loading of a component

In accordance with embodiments of the present disclosure, a system may include a structural member and an isolator/guide. The structural member may define at least a portion of each of two laterally adjacent bays, each bay for receiving a respective modular information handling resource. The isolator/guide may be mechanically coupled to the structural member and include at least one guide pin and a vibrational isolator. The at least one guide pin may be configured to engage with modular information handling resources disposed in each of the two laterally adjacent bays in order to mechanically guide the modular information handling resources during insertion into and removal from the bays. The vibrational isolator may be mechanically coupled between the structural member and the at least one guide pin such that the vibrational isolator provides vibrational isolation between the at least one guide pin and the structural member.

Systems and methods for mechanical isolation of information handling resources

In accordance with embodiments of the present disclosure, a backplane for electrically coupling modular information handling resources to one or more other information handling resources, may include a printed circuit board, a first plurality of slots, and a second plurality of slots. The printed circuit board may have a first surface and a second surface opposite the first surface. The first plurality of slots may be mounted to the first surface and the second plurality of slots may be mounted to the second surface, such that each of the second plurality of slots are offset from an adjacent slot of the first plurality of slots in a direction parallel to a plane defined by the first surface and each of the second plurality of slots are rotated approximately 180 degrees from an adjacent slot of the first plurality of slots.

Backplane for electrically coupling modular information handling resources to one or more other information handling resources

A hard drive encapsulating apparatus includes a housing having an air flow channel and an air flow port. Also, a sound suppression cavity is positioned between the channel and the port. A sound suppression material is mounted in the sound suppression cavity.

Acoustic encapsulating system for hard drives

A fan mounting arrangement ( ) includes at least one mounting member ( ). Each mounting member ( ) includes a resilient outer element ( ) and an inner element ( ) made from a substantially rigid material. The mounting members ( ) are all arranged to extend generally parallel to each other. Each mounting member ( ) is adapted to be received in a corresponding mounting receptacle ( ) associated with a fan housing ( ). Once the fan ( ) is placed over the mounting members ( ) with each mounting member received in its respective mounting receptacle ( ), a retaining arrangement retains the fan in the installed position on the mounting members. In this installed position, the resilient elements ( ) absorb vibrations from the fan ( ) to mechanically isolate the fan from the remainder of the system.

Cooling fan mounting arrangement

An apparatus for mounting a component in a computer includes a computer chassis and a mounting bracket assembly attached to the computer chassis. The mounting bracket assembly includes a first structural layer, a second structural layer spaced apart from the first structural layer wherein a gap is defined therebetween, and a layer of damping material disposed in at least a portion of the gap. The mounting bracket assembly is useful in space-sensitive applications while still providing vibration and acoustical noise attenuation. Furthermore, the mounting bracket assembly provides a nominal degree of impact damping during installation of a system component, reducing the potential for impact related failures.

Mounting bracket assembly for system components in a computer

An apparatus including a base substrate including a reference voltage plane. A plurality of spaced apart printed circuit substrates are attached to the base substrate. Each one of the printed circuit substrates includes a reference voltage plane attached to the reference voltage plane of the base substrate. A system component is removably attached to a first side of at least one of the printed circuit substrates. The system component is electrically connected to the reference voltage plane of the printed circuit substrate. A support member is attached to a second side of each printed circuit substrate. Each support member is electrically coupled to the reference voltage plane of the printed circuit substrate. The support members are electrically connected to a reference voltage plane of the printed circuit substrate to provide a low impedance return current path for the electrical portion of the electromagnetic emissions, thereby reducing the magnitude of electromagnetic emissions.

Apparatus for reducing electromagnetic emissions from a computer

An apparatus including a base substrate and a plurality of spaced apart end brackets attached to the base substrate. A plurality of spaced apart side panel assemblies are removably mounted between a mounting portion of each end bracket. A first edge of each side panel assembly positioned adjacent to the base substrate. A shroud is pivotally attached to each one of the side panel assemblies adjacent to a second edge of the respective side panel assembly. Each shroud is movable about a pivot axis between an open position and a closed position with respect to the respective side panel assembly. A shroud engaging portion is attached to each end bracket adjacent to each shroud. A engagement member of each shroud engages a corresponding shroud engaging portion when the respective shroud is moved from the open position to the closed position for moving the respective printed circuit substrate from an inserted position to a seated position with respect to the base substrate. Fewer components are required to construct the apparatus relative to previous apparatuses, reducing the cost and assembly. Furthermore, the shrouds function as a cam device for seating the system component assembly in the chassis.

Apparatus and method for mounting and cooling a system component assembly in a computer

An apparatus includes a base substrate and a plurality of spaced apart end brackets attached to the base substrate. A pivotable one of the end brackets is movable between a retracted position and an extended position with respect to the base. A plurality of spaced apart side panel assemblies are removably mounted between each end bracket when the pivotable one of the end brackets is in the extended position. A first edge of each side panel assembly is positioned adjacent to the base substrate. A shroud assembly extends between the two side panel assemblies adjacent to a second edge of each side panel assembly. The shroud assembly, the base substrate and the side panel assemblies define an air duct. A fan is mounted adjacent to at least one of the end brackets for directing air through the air duct. The part count of the apparatus is reduced such that cost and assembly time are also reduced. Furthermore, at least one of the end brackets can be pivoted to the retracted position to allow the printed circuit substrate and end brackets to be more easily installed in the chassis as an assembly and to permit cost effective servicing of the apparatus.

Growing community of inventors

Round Rock, TX, United States of America

Robert Warren Johnson