The Whitaker Corporation

Amp LLC

Princeton Lightwave, Inc.

Trumpf Photonics, Inc.

Robert Wallace Roff

Randall Brian Wilson

Terry P Bowen

Zbigniew Janosik

Hongtao Han

Randy Marshall Manning

Randall Bobby Paul

Robert A Boudreau

Warren Hale Lewis

Stefan Heinemann

John Hostetler

Raymond Joseph Menna

Greg W Charache

Yufeng Li

Bruce M Graham

Holger Schlüter

Gregory A Livingston

Hans-Georg Treusch

Ching-Long Jiang

Radosveta Radionova

Chia-Fu Hsu

A laser diode assembly contains a plurality of laser diode chips packaged closely in a row. Each laser diode chip is bonded on both P-side and N-side to first and second sub-mounts. The sub-mounts are then attached to a cooling carrier, with both bonding surfaces perpendicular to the top surface of the carrier. The direction of laser radiation is parallel to the carrier top surface, and the distance between the top of the active area of the laser diode chip and the carrier is preferably in a range of half a pitch between individual laser sources packaged in a row or preferably in a range of 0.2 mm to 1 mm to allow efficient cooling for high power operation. The sub-mounts may be electrically conductive, or they may be of insulating material at least partially covered with a conducting layer. A laser diode chip is bonded uniquely to a set of sub-mounts or may share a sub-mount with another laser diode chip.

Multi-emitter diode laser package

Methods of preparing front and back facets of a diode laser include controlling an atmosphere within a first chamber, such that an oxygen content and a water vapor content are controlled to within predetermined levels and cleaving the diode laser from a wafer within the controlled atmosphere of the first chamber to form a native oxide layer hating a predetermined thickness on the front and back facets of the diode laser. After cleavage, the diode laser is transported from the first chamber to a second chamber within a controlled atmosphere, the native oxide layer on the front and back facets of the diode laser is partially removed, an amorphous surface layer is formed on the front and back facets of the diode laser, and the front and back facets of the diode laser are passivated.

Laser facet passivation

A method of fabricating an optical module includes attaching a lens to a platform of the optical module such that the lens remains in precise alignment with a light source (e.g., a laser diode) and a target optical fiber even after the lens is attached or fixed to the platform. The optical module includes a micro-lens assembly, comprising a bridge and a micro-lens holder holding a micro-lens. The micro-lens holder is initially to the light source to substantially optimize coupling of light into the input aperture of the optical fiber. Next, the bridge is inserted beneath the micro-lens holder on the platform. Subsequently, the bridge is fixedly attached to the platform. The micro-lens holder is realigned to the light source to substantially optimize coupling of light into the input aperture of the optical fiber and then the micro-lens holder is fixedly attached to the bridge.

Method of fabricating an optical module including a lens attached to a platform of the optical module

A method of aligning an optical fiber to a light source (e.g., a laser diode) in an optical assembly includes inserting a weld clip over a ferrule holding the optical fiber so that there is no gap between the ferrule and the weld clip, initially aligning the optical fiber to the laser diode, fixedly attaching the weld clip to a platform, realigning the optical fiber to the laser diode, and fixedly attaching the weld clip to the ferrule.

Method of attaching optical fiber in alignment with a light source in an optical module

The present invention relates to a novel technique for mounting and packaging a passively aligned optical fiber to an optoelectronic device on a silicon optical bench. The silicon optical bench is thereafter mounted on a flat portion of a substantially cylindrical ferrule, preferably ceramic, and an optical fiber protruding from the cylindrical ferrule to the flat portion of the ferrule. The ferrule is toleranced to form either a single mode or multimode connection for the assembly. Thereafter, a substantially cylindrical housing tube is disposed over the assembly, the housing tube being enclosed on one side by the ceramic ferrule. An integral lead assembly, having an overmolded substantially cylindrical plug and electrical leads closes the housing tube on the opposite side of the housing tube from the ferrule. This lead assembly as stated is overmolded and has electrical leads which make contact with electrical leads disposed on the flat portion of the ceramic ferrule.

Package for an optoelectronic device

A passively aligned high performance optoelectronic package in pigtail form which has a reduced cost over the conventional techniques of packaging by virtue of materials and alignment techniques is disclosed. The package of the present disclosure has a ferrule made of material which substantially matches the thermal characteristics of the optical bench, with the ferrule having a flat portion on one end for securing an optical fiber on a receiving group of the optical bench. The material of the ferrule is preferably kovar. Finally, passive alignment of the optoelectronic device to the fiber is effected by way of the ferrule with the flat portion of the ferrule being partially disposed in a second ferrule or sleeve prior to commitment of the sub-assembly into the final package.

Pigtailed package for an optoelectronic device

An optical subassembly for monitoring the emission of a semi-conductor laser is disclosed. The subassembly is diced from a wafer having mounted thereon the devices to be tested as well as the testing optical devices. The devices of the wafer are burned-in and those sections of the wafer having lasers that pass the burn-in testing are diced and form the subassemblies of the present invention.

Monitor-detector assembly on silicon wafer board

A package for an optoelectronic device comprising: a substrate, an optical fiber disposed on the substrate, a ferrule for receiving the optical fiber and having a substantially flat surface for mounting the substrate; a housing member having a first end and a second end. The ferrule is disposed in the first end and a plug member is disposed in the second end of the housing.

A bidirectional link for simultaneous or sequential transmission and reception of optical signals is disclosed. A simple alignment process is used in which the emitter or transmitter is disposed in a subassembly having a subhousing with a beamsplitter therein. This is then inserted into the main housing with the other device mounted therein.

Microoptic bidirectional module

A burn-in assembly is disclosed having a substrate on which devices to be tested are die and wire bonded. Circuitry for effecting the burn-in testing is connected to the devices under test, and after testing is complete, the substrate is diced into individual optical submounts for packaging.

Laser/pin assembly with integrated burn-in assembly

The present invention relates to a lensed fiber assembly having disposed therein an optical fiber, canted at an angle to the axis of light propagation, so as to adequately reduce back reflection of light into an optically active device coupled to the optical fiber. The design of the present invention enables quick and accurate alignment of the optical fiber with the active optical device by movement of the lensed fiber assembly either on axis with and/or orthogonal to the axis of light propagation.

Lensed optical fiber assembly and process for alignment with an active

A connector assembly includes an active fiber needle 1 having a passive or active optical device 6 connected to an end face 7 of a thick metallized coating 4 and a cup-shaped mount 10 for hermetically enclosing the optical device. The mount 10 hermetically encloses the optical device 6 and provides heat dissipation and electrical connections for optical device 6. The cup-shaped mount may include a ceramic tubular sleeve hermetically sealed to the metal coating 4 on the fiber needle 1 about a central bore 12A thereof. Electrical connections between the optical device 6 and devices external to the mount may preferably be provided through a spring contact 18 which is soldered to terminals on device 6 and has at least one leg 18A, 18B extending through the hermetically sealed cup-shaped housing 10. Other embodiments of electrical lead connections may be provided by wire bonds 24 between device 6 and external metallization surfaces 26A.

Submount and connector assembly for active fiber needle

An optical connection for connecting an active optical device (6,52) or a passive optical device (41,63) to an optical fiber (3), having a thick metal coating (2) deposited circumferentially around the fiber. In this optical connection the device (6,52,41,63) is bonded to the polished endface of the fiber (5), with particular use being made of the thick metal surface (7) on the endface of the fiber. In another embodiment, the optical fiber (3) is etched to form various surfaces (31,32,33) for optical coupling. This etching also allows for accurate passive alignment of an etched active device (52) or a passive device (42,63) with the optical fiber.

Active fiber needle

A connector assembly (10) for connecting a laser diode (14) and an optical fiber (12). The assembly (10) includes an optical connector subassembly (26) having an input for collecting optical energy emitted by the laser diode (14) and an output for transmitting a beam of the collected optical energy to the optical fiber (12), and attenuation means (24) between the input and the output for reducing the power of the beam of collected optical energy at the output to be transmitted to the optical fiber (12). A connector assembly of the present invention is effective in transmitting energy from a light source to an optical fiber with the same accuracy of alignment as a coupling of an optical fiber to an optical fiber; and, at the same time, is effective in controlling the power of the transmitted energy to protect against accidental injury due to inadvertent viewing of the light source when the optical fiber is disconnected from the assembly and to control the power of the optical energy entering the optical fiber.

Aperture disk attenuator for laser diode connector

A connector body 4 encircling an optical focusing element 5, a laser diode 3 having an emission axis aimed along an axis at an absorption end 6 of the focusing element 5, the focusing element 5 converting diverging optical emission of the laser diode 3 into a converging beam of radiation, and a coupler element 7 contacting the focusing element 5 without an air gap therebetween to receive the beam of radiation without backward reflection, the connector body 4 having a socket 9, and the coupler element 7 having a front end 8 in the socket 9 for physical contact with an end 10 of an optical fiber 2 disconnectably inserted in the socket 9.

Growing community of inventors

Westfield, NJ, United States of America

Robert Wallace Roff