International Business Machines Corporation

Robert W Nesky

Jeffrey Scott Campbell

Benson Chan

Russell E Darrow

John D Larnerd

Glenn J Ingraham

A socket connector system for forming a separable electrical contact between a first circuit substrate and a second circuit substrate. A dendrite interposer is disposed between the first circuit substrate and the second circuit substrate. A solder body is disposed between the first circuit substrate and the dendrite interposer. The solder body may include one of several types of solder columns or a solder ball. The solder body has a contact end which engages the dendrite interposer. The contact end has a void. An area of the contact end engages the dendrite interposer when compressive forces are exerted on the first circuit substrate and the second circuit substrate. This provides for all areas of a plurality of contact ends to engage and form reliable electrical contacts with the contact pads.

Solder column tip compliancy modification for use in a BGA socket

A technique for applying uniform force to an IC chip module, urging the module into electrical contact with one face of a circuit board, is provided. One face of the board has contact pads, and the module has contact members on one surface corresponding to the contact pads. A first clamping member is provided having a pressure applying section and a reaction section mounted for movement toward and away from each other. A second clamping member having a pressure applying section is provided. The module is interposed between the pressure applying element of one of the clamping members and the substrate with the contact members on the module in electrical contact with the pads on the board. Several pins interconnect the reaction section of the first clamping member and the second clamping member to restrain movement of the reaction section of the first clamping member away from the second clamping member. At least one biasing member, preferably including a belville washer, is interposed between the reaction section and the pressure applying section of the first clamping member urging the reaction section and the force applying section away from each other to thereby exert force against the module urging it into electrical connection with the pads on the board. Also, preferably a locator is provided to locate the planar element, and an interposer is provided between the contacts on the planar element and the contacts on the substrate. The interposer has vias terminated at both ends in dendrites.

Module mounting assembly

A machine for forming a head and a bulge on a copper pin and to connect the pin to a ceramic substrate by a single application of impact force at high velocity and controlled energy conditions includes an air cylinder within which a piston of controlled mass moves due to the effect of compressed air stored in an accumulator. A die block includes a two dimensional array of holes into which are fitted pin blanks that extend above the surface of the die block and on which is fitted a substrate having an identical array of pin holes formed therein. The pins are fitted within the die block and on the substrate such that a predetermined length of the pin blank extends above the surface of the substrate and a controlled length of the pin blanks extends between the substrate and the die block. The pins are retained within the die against axial movement and the holes in the substrate and die block provide radial restraint to the pins following the application of the impact force. The substrate is elastically supported to deflect after impact while the pin head and bulge are forming.

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Nicholson, PA, United States of America

Robert W Nesky