Hewlett-packard Company

Bt&d Technologies Limited

Other

Effect Photonics B.v.

Agilent Technologies, Inc.

Jds Uniphase Corporation

Bookham Technology Limited

Adva Optical Networking Se

Musk, Robert W.

Robert W Musk

Alistair Neil Coles

David George Cunningham

Mark Charles Nowell

Michael S Lebby

Gary Richard Trott

Phillip J Edwards

Joseph John Vandenberg

Bradley S Levin

Samuel B Ho

James David Hamerslag

Tim Koene

Gerald J Gleason

Christopher F Beesley

Lawson H Fisher

Disclosed is an optical multichannel transmission and/or reception module, in particular for high-bitrate digital optical signals, with a housing having multiple optical input ports and/or optical output ports and containing an electric assembly and an essentially flat opto-electric module connected electrically to the electric assembly. Multiple electro-optic transmission elements and/or multiple opto-electric reception elements are located on or in the opto-electric module. The opto-electric module has an optical coupling area on one of its surfaces that is connected to the respective first ends of multiple optical waveguides. The opto-electric module has multiple optic paths for optical connection of each first end of an optic waveguide with an associated electro-optic transmission element and/or an associated opto-electric reception element.

Optical multichannel transmission and/or reception module, in particular for high-bitrate digital optical signals

An optical subassembly () includes a photonic integrated circuit (), an external optical system () and an optical interface () that is arranged between the PIC and the external optical system. The optical subassembly includes a third material () and a fourth material (). The third material () at least partially fills the optical interface between the PIC and the external optical system in order to minimize contamination of any kind. The fourth material () being in contact at least with the third material for sealing at least the third material from ambient moisture. In this way a low-cost near-hermetic environmental protection barrier () may be provided. An optical system () including the optical subassembly and a method of fabricating such an optical subassembly are also described.

Optical subassembly, optical system and method

Disclosed is an optical subassembly () including a carrier substrate (), a photonic integrated circuit () (PIC) including a first optical waveguide () having a first longitudinal central axis, the PIC being arranged on the carrier substrate, an external optical system () including a second optical waveguide () having a second longitudinal central axis, a component () for supporting the external optical system on the carrier substrate and maintaining alignment of the first and second longitudinal central axes with respect to each other, and an adhesive material () being arranged between the component and the carrier substrate and between the component and the external optical system, the adhesive material having a total thickness of less than 10 &#x3bc;m. Also disclosed is an optical system () including such optical subassembly and a method of fabricating such optical subassembly.

An assembly () includes a substrate () that is provided with at least one electrical contact (), a flexible printed circuit membrane () including an electrically insulating film () and an electrically conducting layer () that is at least partially covering the insulating film (). The conducting layer () is at least locally accessible from outside of the membrane (). A connection element () is provided for electrically connecting the at least one electrical contact () and the conducting layer () at a position where the conducting layer () is accessible, to form an electrical connection between the substrate () and the membrane (). A chip package () includes a housing () having at least one electrically conducting terminal, and an assembly () as mentioned. The flexible printed circuit membrane () is arranged for electrically connecting the substrate and the at least one terminal of the housing ().

Assembly and a chip package

An electro-optic package comprising an optoelectric module with a receptacle assembly, an optoelectric assembly fixedly attached to the receptacle assembly, the optoelectric assembly being in communication with the optoelectric module, wherein the optoelectric assembly includes optoelectronic circuitry and the optoelectronic circuitry includes at least one electrical connection for communication with external electronic circuitry, and wherein the electro-optic package forms a discrete package.

Discrete optoelectric package

An optoelectronic subassembly for optoelectronic modules includes a supporting substrate with an optoelectronic device mounted on a mounting surface. A supporting structure includes a trench for mounting the subassembly and a lens assembly. Four offset arms are provided each including a substrate-mounting portion, a supporting-structure-mounting portion, and a linking portion. The substrate-mounting portion and the supporting-structure-mounting portion have parallel surfaces with the linking portion extending at an angle therebetween. The arms include deformable material for allowing small changes in the angle. One of the parallel surfaces of each of the offset arms is mounted on either the mounting surface or an opposed surface of the supporting substrate and the other of the parallel surfaces is mounted on the support structure with the substrate suspended in the trench. The linking portion of the arms is then deformed to align the optoelectronic device with the lens assembly.

Optical subassembly for optoelectronic devices

A power monitoring arrangement for semiconductor light emitting devices used in optoelectronic packages includes a mounting structure, a light emitting device, and a monitor photodetector. The mounting structure has a mounting surface with the light emitting device and the monitor photodetector positioned thereon. The light emitting device provides emitted light at a monitoring output and an active output. The monitor photodetector has a light sensitive region and is positioned on the mounting surface of the mounting structure proximate the monitoring output of the light emitting device. A hemisphere of material is formed to include at least the light sensitive region of the monitor photodetector and the monitoring output of the light emitting device. An outer surface of the hemisphere operates as a reflecting surface to reflect light from the monitoring output of the light emitting device to the light sensitive region of the monitor photodetector.

Optical power monitoring for a semiconductor laser device

An optoelectronic package includes a supporting structure with a surface, an opposed surface, and at least one side, at least one conductive interconnect extending through the supporting structure from the surface to the opposed surface of the supporting structure, wherein the at least one conductive interconnect is substantially flush with the opposed surface of the supporting structure.

High speed to-package external interface

A method and apparatus is provided for connecting an optical source to a multimode optical fibre in a multimode optical fibre communications system. A single mode fibre length is provided such that optical radiation admitted from an optical source at one end of the single mode fibre length is provided to a multimode optical fibre at the other end of the single mode fibre length. This method and apparatus is used in a duplex patchcord for connecting an optical transceiver to a pair of installed multimode fibres. The second fibre in the patchcord is a multimode fibre for passing optical signals to the optical receiver of the transceiver.

Multimode communications systems

An assembly for aligning at least one optical component with respect to a light path is described. This assembly includes a substrate having at least one integrally formed, flexural member defined by one portion of the substrate and a primary substrate portion defined by another portion of the substrate. The flexural member includes a component mounting area such that the optical component is mountable thereon and, when the optical component is so mounted, the optical component is movably alignable in the light path by displacement of the component mounting area of the flexural member relative to the primary substrate portion.

Micro-alignment of optical components

A method of attaching a component onto a microbench includes laying the component in a groove in the substrate, and locally deforming a portion of the groove, to thereby hold the component in the groove. Preferably, the microbench is a silicon substrate used for MEMs-type structures in the fiber optics industry. In particular, the method is used for securing an optical fiber in a groove, DRI etched from a silicon substrate, before or after the fiber is aligned with other optical components, i.e. lenses, lasers etc. The local deformation is done using a laser welding device selected to be effective in locally melting the substrate while leaving the component relatively undamaged.

Securing an optical component onto a micro bench

A micro-photonics device is described that includes a substrate and a plurality of optical and electrical components mounted on the substrate. The optical and electrical components form a transmitter and a receiver. A wall is mounted on the substrate to physically separate some of the components from other components to prevent electrical and optical interference between the transmitter and receiver. The wall mounted on the substrate may also be mounted with electrical and optical components of the micro-photonics device. In this case, the wall physically separates the components mounted on the substrate from the components mounted on the wall to prevent electrical and optical interference. Moreover, the wall with the mounted components may simply be attached to a side surface of the substrate.

Micro-photonics module with a partition wall

An optical connector is provided for connecting an optical fiber to, for example, a laser. The optical connector comprises a housing defining a passage therethrough and a stop for abutment against a face of a ferrule containing an optical fiber. The stop is positioned and shaped so that in use the area of contact between the stop and the ferrule end face is less than 10% of the total area of the end face of the ferrule, and the area of contact between the stop and the ferrule end face is close to a central axis of the ferrule. Many different designs of angled ferrule are available for reducing the level of optical reflections within optical systems. The present optical connector allows these many different designs of angled ferrules to be accurately aligned to an optical device.

Growing community of inventors

Ipswich, United Kingdom

Robert W Musk