USA as Represented by Secretary of the Navy

Robert W McElhanon

William K Burns

Ganesh K Gopalakrishnan

Underplating between a metallic plating base and a photoresist deposited reon can be reduced or eliminated by a method of fabricating a microstructure which includes the steps of:

Adhesion enhancement for underplating problem

A process for making thick metal structures on a substrate has the steps of: selectively exposing a thick layer of photoresist disposed on a substrate to ultraviolet radiation including the 350 nm to 450 nm portion of tile spectrum of a mercury vapor lamp, where the photoresist layer is a heat-treated arid hydrated photoresist layer, to fully pattern the substrate: developing the patterned substrate by contacting the photoresist layer with a photoresist developing solution; exposing the photoresist layer to a plasma for hardening the pattern against thermal flow; hardbaking the photoresist pattern on the substrate; plating the metal onto the patterned substrate using a low current density (J) during at least part of the plating process, making a thick methyl structure on the substrate.

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Bryans Road, MD, United States of America

Robert W McElhanon