Motorola Corporation

Robert W Kamb

David James Dougherty

John W Hart, Jr

Paul L Sullivan

A package assembly (70) for encapsulating and vertically surface mounting a semiconductor device such as an accelerometer includes a semiconductor device (40), a package (44) enclosing the semiconductor device, and a plurality of leads (16, 18) protruding from the package. The plurality of leads are formed from a common leadframe (10) and an internal portion of a first lead of the plurality of leads is offset from a common plane corresponding to the common leadframe prior to forming any of the plurality of leads. The offset lead increases the rigidity and vibration-resistance of the package assembly.

Growing community of inventors

Gilbert, AZ, United States of America

Robert W Kamb