International Business Machines Corporation

Robert W Broadie

Joseph Adam Aboaf

H Bernhard Pogge

Edward M Hull

Bernard M Kemlage

William A Pliskin

H Bernard Pogge

A semiconductor device, such as a transistor, integrated circuit or the like, having a pattern of oxidized and densified porous silicon regions extending onto one of its major surfaces for isolating regions of the semiconductor is manufacturable by a relatively simple process. The process involves forming porous silicon regions in the surface of the semiconductor body such as a silicon wafer, in the areas where dielectric isolation between semiconductor devices is desired. The porous silicon regions are then oxidized at a temperature sufficient to completely oxidize the porous silicon. The oxidiation is such that the oxidized porous silicon extends above the surface of the semiconductor wafer. The oxidized porous silicon regions are then subjected to a temperature higher than the oxidizing temperature utilized in the previous step to cause the densification of the oxidized porous silicon regions. The result of this densification step is the collapse of the porous oxide to a dense structure which is substantially planar with the surface of the semiconductor wafer. This densified silicon dioxide structure has an etch rate which is substantially the same as thermally grown silicon dioxide.

Integrated circuit isolation structure and method for producing the

A high power semiconductor device is formed by providing a semiconductor substrate of N.sup.- conductivity, rendering the backside of same porous as by subjecting same to anodic treatment carried out in a concentrated solution of hydrofluoric acid, converting the porous region to an N.sup.+ region, as by arsenic diffusion and forming an active device by conventional techniques in the top surface of the substrate. The method permits usage of high quality N.sup.- substrates and at the same time eliminates the requirement of growing thick epitaxial layers.

Method for producing high power semiconductor device using anodic

A process for producing light emitting diodes is disclosed. In the process a primer layer of GaP is pyrolytically deposited on a Si substrate with the resulting epitaxial film thickness being sufficient to form complete coalescence of the epitaxial nuclei, but thin enough to avoid cracks in the epitaxial layer due to stress induced by thermal expansion. The thickness is generally between 0.1-10.mu.. A second layer of GaP is then deposited using the standard halide transport process with thicknesses of 2-5 .mu. or higher. In the case of GaP LED's the thickness is about 10-40 .mu., whereas for the case of GaAsP LED's the GaP thickness is 2-5 .mu. and this is then followed, through the addition of AsH.sub.3, with GaAsP graded from the GaP composition to the particularly desired design composition. The final composition is then maintained for 10-20 .mu..

Two stage heteroepitaxial deposition process for GaP/Si

High power semiconductor device

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Robert W Broadie