Delphi Technologies, Inc.

Robert Vajagich

Scott David Brandenburg

Gary Eugene Oberlin

Mark Anthony Koors

Charles I Delheimer

An integrated circuit assembly is provided, including a substrate having at least one substrate contact surface , an integrated circuit device having at least one first contact surface , and a bar bond element . The bar bond element provides communication between the at least one substrate contact surface and the at least one first contact surface . The bar bond element includes a conductive plate element having an integrated circuit foot portion , a substrate foot portion and a strain relief loop positioned between the integrated circuit foot portion and the substrate foot portion

Integrated circuit assembly with bar bond attachment

A method and assembly for mounting an IC semiconductor device to a substrate using flip chip technology. The assembly generally entails a flip chip having a first surface, an oppositely-disposed second surface, an integrated circuit that includes a vertical device on the first surface, and an electrical contact for the vertical device on the second surface. The flip chip is bonded with first solder connections to a first conductor pattern on a substrate, so that the first solder connections electrically and mechanically connect the flip chip to the substrate. The assembly further includes an electrical contact member that is positioned so that the flip chip is between the contact member and the substrate. The contact member is electrically and mechanically connected to a second conductor pattern on the substrate with second solder connections. A third solder connection electrically and mechanically connects the contact member to the electrical contact on the second surface of the flip chip.

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South Milwaukee, WI, United States of America

Robert Vajagich