Bridgelux Incorporated

Robert Tudhope

Vahid S Moshtagh

Alexander Rizkin

Hannu Tapani Hukkanen

Tomi Mikael Kuntze

R Scott West

Wenhui Zhang

Xiaolu Chen

A light module includes a light emitting diode (LED) array and a double-reflective assembly coupled to the LED array. The double-reflective assembly includes a lower member having a frame. The frame has an opening corresponding to the LED array. The frame and LED array are located in the same plane. The light module further includes a left bottom reflector and a right bottom reflector. The light module further includes an upper member which includes a left top reflector; and a right top reflector, wherein the left top reflector is attached to the left bottom reflector, and right top reflector is attached to the right bottom reflector, each forming an arbitrary left and right double-reflective assembly. A shape geometry and profile of each double-reflective assembly provides a pre-calculated combined non-circular asymmetrical intensity distribution pattern. The intensity distribution pattern is a superposition of light reflected from the bottom reflectors, light reflected from the top reflectors, light doubly reflected from both the top and bottom reflectors, and light directed into the intensity distribution pattern directly from the LED array.

Highly efficient LED array module with pre-calculated non-circular asymmetrical light distribution

A solid-state light-emitting device ('SLD') converting electrical energy to photon energy using a light emitter diode ('LED') and high-temperature multi-layer optics (&#x201c;HMO&#x201d;) is disclosed. The SLD, in one aspect, includes a chip-on-board (&#x201c;COB&#x201d;), a silicone inner layer (&#x201c;SIL&#x201d;), and a Poly methyl methacrylate (&#x201c;PMMA&#x201d;) layer. The COB includes a first surface and a second surface wherein the first surface includes at least one LED. The LED converts electrical energy to optical light and the light subsequently leaves the LED becoming visible light. The SIL includes a first silicone surface and a second silicone surface wherein the second silicone surface is in contact with the first surface of COB and the second silicone surface is in contact with the PMMA layer. The operating temperature of PMMA layer is lower than the operating temperature of SIL.

Method and apparatus for providing high-temperature multi-layer optics

A low-profile lighting module with light-emitting diodes (LEDs) has a water-tight seal between a molded-plastic cover and a printed circuit board (PCB). A substrate with the LEDs fits up into an indentation in the lower surface of the PCB. Landing pads on the top of the substrate attach to contact pads in the indentation that are extensions of a conductor of the PCB which is electrically coupled through the landing pads to the LEDs. A lens with a curved optical portion surrounded by a flat lip fits into another indentation on the upper surface of the PCB. A highly reflective sheet is disposed between the planar lower surface of the lens and bottom of the indentation in the upper surface. A double-sided adhesive sheet is disposed under the inside surface of the molded-plastic cover and over both the upper surface of the PCB and the flat lip of the lens.

Low-profile outdoor lighting module with light emitting diodes

Growing community of inventors

Livermore, CA, United States of America

Robert Tudhope