Apr Technologies Ab

Aac Microtec Ab

Chillwind Technologies Ab

Robert Thorslund

Peter Nilsson

Are Björneklett

Mikael Antelius

Henrik Löfgren

Jürgen Leib

Are BJÖRNEKLETT

An arrangement for thermal management is disclosed, wherein a heat generating component is arranged within an enclosure, defined by an enclosure wall and in thermal contact with a thermal management fluid. The arrangement comprises an electrohydrodynamic flow unit, comprising a first and a second electrode, for controlling the flow of fluid within the enclosure.

Cooling of electronic components with an electrohydrodynamic flow unit

A method for altering one or more properties of a dielectric fluid for use in an electrohydrodynamic, EHD, thermal management system (), as well as the system, are provided. The system comprises at least one EHD pump unit () comprising at least two electrodes for pumping the dielectric fluid and at least one enclosure () for accommodating the fluid within the system. The method comprises exposing the dielectric fluid to an ionizing process () configured to ionize the dielectric fluid, and operating the pump unit to circulate the exposed fluid in the enclosure.

Electrohydrodynamics system and method

A thermal control system includes a closed loop arranged to carry a circulating fluid. There is at least a first heat exchanger and a flow unit in the closed loop. The flow unit includes a first electrode and a second electrode offset from the first electrode in a downstream direction of a flow of the circulating fluid. The first electrode and the second electrode are connectable to a voltage source. The first electrode is formed as a grid structure and arranged to allow the circulating fluid to flow through the first electrode.

Thermal control system

A fluidic device is disclosed, comprising an enclosed passage that is adapted to convey a circulating fluid. The enclosed passage comprises a flow unit having a first electrode and a second electrode offset from the first electrode in a downstream direction of a flow of the circulating fluid. The first electrode is formed as a grid structure and arranged to allow the circulating fluid to flow through the first electrode. The fluidic device may be used for controlling or regulating the flow of the fluid circulating in the enclosed passage, and thereby act as a valve opening, reducing or even closing the passage.

Electrohydrodynamic control device

A battery device () is disclosed, comprising a plurality of cells (), an enclosure () configured to accommodate cells when they are at least partly immersed in a thermal management liquid, and at least one flow unit () arranged within the enclosure to control a flow of the thermal management liquid through the enclosure. The at least one flow unit comprises a first electron () and a second electrode () that are arranged offset from each other and being connectable to a voltage source so as to affect the flow between the electrodes.

Immersion cooling of battery device

A device () for controlling a flow of a gaseous fluid is disclosed. The device comprises a first electrode () and a second electrode () offset from the first electrode in a downstream direction of the flow. The electrodes are connectable to a voltage source. A thermally conducting flange () is arranged to extend in a plane parallel to a direction of the flow and adapted to dissipate heat from the gaseous fluid. At least a portion of the first electrode has a maximum height (h) in a direction parallel to a direction of the flow and a maximum width (w) in a direction orthogonal to the direction of the flow, wherein said maximum height is larger than said maximum width so as to improve the pumping efficiency of the device. A method for manufacturing the device, and a method for controlling a fluid flow by means of such device, is also disclosed.

Microfluidic fan

An array of flow units for controlling a flow of a fluid is disclosed. The flow units are arranged to have a lateral extension in a common lateral plane. A downstream side of a first flow unit is in fluid communication with an upstream side of a second flow unit to allow a flow of fluid to pass through the flow units. The flow units comprise first and second electrodes which are connectable to a voltage source. At least a portion of the first electrode has a maximum height in a direction parallel to the direction of the flow and a maximum gauge in a direction orthogonal to the direction of the flow, wherein the maximum height is larger than the maximum gauge to improve the pumping efficiency of the device. A method for controlling a fluid flow using the array is also disclosed.

Microfluidic array

Coil assembly () comprising a planar coil () comprising a plurality of turns () arranged in a trench () in a first magnetic core plate () and a second magnetic core plate (), where the first magnetic core plate () and second magnetic core plate () are in direct contact with each other or separated by an electrically insulating insulator layer () with a thickness (t) equal to or less than 50 &#x3bc;m and least one tap () extends from the coil () in a respective via hole () through the first magnetic core plate () to a respective contact pad (), wherein the coil () and the tap () are integrally formed.

Coil assembly comprising planar coil

The present invention provides a method of forming a via hole (), or a via (), from a lower side () of a substrate () for electronic devices towards an upper side () of a substrate () at least partly through the substrate (). The method comprises the steps of: etching a first lengthwise portion () of the via hole () and etching a second lengthwise portion () of the via hole (); whereby the first lengthwise portion () and the second lengthwise portion () substantially form the via hole () and a constriction () is formed in the via hole (). The constriction () defines an aperture () of the via hole () and the method further comprises the step of opening the via hole () by etching, with the constriction () functioning as an etch mask. A via is formed by at least partly filling the via hole with conductive material. A substrate for electronic devices comprising a via is also provided.

Growing community of inventors

Steningehöjden, Sweden

Robert Thorslund