Motorola Corporation

Other

Robert Thomas Carson

Arnold W Hogrefe

Lisa Reckleben

Frank J Juskey, Jr

Frank J Juskey

Scott Lawrence Joslin

Arnold William Hogrefe, Jr

Dawn He Zhong

A clamp for a water bottle cage having a mounting plate with spaced apertures comprising a first part having a rear hemispherical cavity, a front face having threaded bores having the same spacing as the apertures on the plate and a rear face having spaced threaded bores receives threaded fasteners for fastening the plate to the clamp. A second part having a front hemispherical cavity and spaced apertures receives threaded fasteners for clamping a water bottle cage to tubing such as the handlebar of a bicycle.

Handlebar clamp for water bottle cage

An electronic assembly (10) comprises one or more electronic components (18) having solder terminations (20), and a printed circuit substrate (12) having printed circuit traces (14, 16), wherein at least one of the solder terminations of the one or more electronic components (18) and the printed circuit traces (14, 16) of the printed circuit substrate (12) has a secondary finish produced by application of an electrolessly deposited nickel film (26) containing phosphorus which is further plated with gold (28). An indium-tin-lead solder paste (22) is utilized in a soldering process to attached the one or more electronics components (18) to the printed circuit traces (14,16) on the printed circuit board (12), such that the indium-tin-lead solder (22) provides improved solder joint integrity with the secondary finish. The electronic components (18) include semiconductor devices such as ball grid arrays (1000) and flip-chip integrated circuits (1010).

Electronic assembly

An integrated circuit (230) for attaching to a glass substrate (225) includes an integrated circuit die (350) having circuitry formed thereon. The integrated circuit (230) has cavities (380) formed in a first surface, and metal layers (370) formed adjacent to the integrated circuit die (350) and within the cavities (380) are coupled to the circuitry. Conductive bumps (260), which are formed from a material that adheres to glass, are deposited within the cavities (380) and electrically coupled to the circuitry via the metal layers (370).

Integrated circuit for directly attaching to a glass substrate and

A selective call receiver (900) includes a ceramic substrate (820) for conveying an electrical signal. The ceramic substrate (820) has at least one solder pad which includes a solder pad area (110) of an electrical conductor (120) on the ceramic substrate and a solder wettable layer (210). The electrical conductor (120) consists essentially of a conductive ceramic material. The solder wettable layer (210) is attached to the solder pad area (110). The solder wettable layer (210) includes at least 50% indium by weight. A circuit device (410) has at least one circuit terminal which is soldered to the at least one solder pad of the ceramic substrate (820) for electrical interconnection to another circuit device (410) in the selective call receiver (900).

Selective call radio having a ceramic substrate for circuit device

A solder pad for mechanically and electrically coupling solder terminals (420) of electronic devices (410) to a non-conductive ceramic substrate (130) includes a solder pad portion (110) of a conductive runner (120) and a solder wettable layer (210). The solder pad portion (110) of the conductive runner (120) is on the non-conductive ceramic substrate (130). The conductive runner (120) consists essentially of a conductive ceramic material. The solder wettable layer (210) is attached to the solder pad portion (110). The solder wettable layer (210) includes at least 50% indium by weight.

Conductive solder pad for bonding an electronic device to a ceramic

A conductive adhesive (120) for electrically and mechanically bonding circuit terminals (105) includes a polymer (121) having a predetermined curing temperature range, a first conductive particulate material (125) suspendable in the polymer (121) for providing substantially uniform conductivity throughout the conductive adhesive (120), and a second conductive particulate material (130) suspendable in the polymer (121) for metallurgically bonding together particles of the first particulate material (125). The first conductive particulate material (125) provides substantially uniform conductivity throughout the conductive adhesive (120) and includes metallic particles having a melting point above the curing temperature of the polymer. The second conductive particulate material (130) welds together particles of the first particulate material (125) and includes metallic particles having a melting point within the curing temperature range of the polymer (121).

Growing community of inventors

Lantana, FL, United States of America

Robert Thomas Carson