International Business Machines Corporation

Robert T Wiley

Voya Rista Markovich

Suryadevara Vijayakumar Babu

Joseph G Hoffarth

John P Wiley

Donald J Lazzarini

Frank W Haining

William F Herrmann

Robert V Rubino

The invention features a method of fabricating a printed circuit board with low dielectric materials using a modular technique. Sub-assemblies are first constructed, tested, and then subsequently incorporated into the final circuit board assembly which has a triplate geometry. Dielectric materials are chosen which enhance the performance of the circuit board.

Low dielectric printed circuit boards

A method of making a printed circuit board is disclosed wherein metallic seed particles are applied to a surface of the substrate. An image of the desired conductor pattern is defined by a maskant layer to permit the subsequent electroless deposition of the conductor material upon the exposed seeded areas of the substrate. Then, the substrate surface is subjected to a plasma discharge to facilitate removal of the seed particles.

Method of removing seed particles from circuit board substrate surface

A process for stabilizing printed circuit board substrate or laminate through application of a number of laminate conditioning and baking cycles which function to provide the laminates with dimensional stability. This enables greater control and more precise drilling of the laminates in subsequent fabrication and assembly operations. The dimensional stability for a substrate becomes more critical as the substrate size is increased.

Stabilization of printed circuit board core laminates

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Binghamton, NY, United States of America

Robert T Wiley