Raytheon Company

Robert T Manley

Brandon William Pillans

Waid A Paine

Monte R Sanchez

An interconnect is provided that can comprise a recess formed in a body where the recess comprises an axial end wall and a side wall extending from the axial end wall. The interconnect can also comprise a distributed metallized layer disposed on the axial end wall and the side wall and a conductive compliant (CC) plug disposed within the recess to interface with the metallized layer. The CC plug can be configured to establish an electrical connection between a conductive pad disposed on the recess and a male conductive element inserted into the recess via the metallized layer.

Interconnect and method for manufacturing the same

A radio-frequency (RF) heat shield for electronics includes a first and second outer skin formed of an insulating material, an insulating core layer arranged between the first and second outer skin, wherein the insulating core layer has a lower dielectric constant as compared with a higher dielectric constant of the first and second outer skin, and a frequency selective surface (FSS) layer including a reflective metallization pattern that is RF transparent and formed on an exterior surface of each of the first and second outer skin.

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Allen, TX, United States of America

Robert T Manley