International Rectifier Corporation

Primarion Corporation

Infineon Technologies Americas Corp.

Infineon Technologies Austria Ag

Other

Infineon Technologies Ag

Chil Semiconductor Corporation

Intel Corporation

Robert T Carroll

Venkat Sreenivas

Benjamim Tang

Gary D Polhemus

Scott Wilson Southwell

Kenneth A Ostrom

Donald J Desbiens

Richard Pierson

Gary D Martin

Nicholas Robert Steffen

James Noon

Benjamin Tang

William B Pohlman

Amir Babazadeh

Keith Nelson Bassett

Anthony B Candage

Angela Kessler

Tim Ng

Hrvoje Jasa

Ronald B Hulfachor

Michael T Zhang

Robert Fehler

Suresh V Golwalkar

David Williams

Michael W Eisele

John Ryan Goodfellow

C Phillip McClay

Steven Joseph Schulte

Lawrence Spaziani

Kannan Raj

David M Susak

Malay Trivedi

Parviz Parto

Jens A Ejury

James R Garrett

Thomas Duffy

Kevin J Cote

Clifford Duong

John M Burns

Erik A McShane

Ken Ostrom

Timothy M Ng

Noah Davis

Kevin Mori

Wuchun Chou

Charles P Amirault

Frank Kern

Saurabh Jayawant

Sampath K V Karikalan

Robert M Smith

Dror Barash

A method includes providing an interposer that includes an electrically insulating substrate, upper contact pads disposed on an upper surface, and lower contact pads disposed on a lower surface, providing a semiconductor package that includes a semiconductor die embedded within a package body and a plurality of package terminals exposed from the package body, providing a first passive electrical element that comprises first and second terminals, forming a first electrical connection between the first terminal of the first passive electrical element and a first one of the lower contact pads via the interposer, forming a second electrical connection between the second terminal of the first passive electrical element and a first one of the package terminals, and forming a third electrical connection between a second one of the package terminals and a second one of the lower contact pads via the interposer.

Semiconductor package and passive element with interposer

A semiconductor assembly includes an interposer that includes an insulating substrate, a plurality of upper contact pads on an upper surface of the substrate, and a plurality of lower contact pads on a lower surface of the substrate, a semiconductor package that includes a semiconductor die embedded within a package body and a plurality of package terminals exposed from the package body, a first passive electrical element that includes first and second terminals, a first electrical connection between the first terminal of the first passive electrical element and a first one of the lower contact pads via the interposer, a second electrical connection between the second terminal of the first passive electrical element and a first one of the package terminals, and a third electrical connection between a second one of the package terminals and a second one of the lower contact pads via the interposer.

An apparatus comprises an emulator and a corresponding compensator. During operation, the emulator produces, at different instants of time, an emulated output current value representative of an amount of current supplied from an output voltage to a load. In general, the compensator provides selective compensation to the emulated output current value over time. For example, for a first time duration, compensation adjustments from the compensator are used to modify the emulated output current value. For a second duration of time, compensation adjustments from the compensator are not used to modify the emulated output current value. Disabling or discontinuing application of adjustments (such as based on the actual measured output current) during the second time duration (such as during a respective transient condition) provides more accurate and timely generation of a respective emulated output current value.

Current emulation in a power supply

According to example configurations herein, an apparatus comprises a die and a host substrate. The die can include a first transistor and a second transistor. A surface of the die includes multiple conductive elements disposed thereon. The multiple conductive elements on the surface are electrically coupled to respective nodes of the first transistor and the second transistor. Prior to assembly, the first transistor and second transistor are electrically isolated from each other. During assembly, the surface of the die including the respective conductive elements is mounted on a facing of the host substrate. Accordingly, a die including multiple independent transistors can be flipped and mounted to a respective host substrate such as printed circuit board, lead frame, etc.

Electrical connectivity of die to a host substrate

A switched-capacitor converter includes a rectifier at the output, a plurality of legs coupled between the input and the rectifier, and a controller. Each leg of the switched-capacitor converter includes a capacitor, and a switch device is connected to each leg. A first group of the legs is coupled to a first branch of the rectifier, and a second group of the legs is coupled to a second branch of the rectifier. The controller alternates switching of the first and second groups of legs after startup, to transfer energy from the input to the output during a first part of each switching cycle via the first group of legs and to ground during a second part of each switching cycle via the second group of legs. The controller or a current limited source provides for pre-charging of at least one of the capacitors during startup.

Switched-capacitor converters with capacitor pre-charging

According to example configurations herein, a leadframe includes a first conductive strip, a second conductive strip, and a third conductive strip disposed substantially adjacent and substantially parallel to each other. A semiconductor chip substrate includes a first array of switch circuits disposed adjacent and parallel to a second array of switch circuits. Source nodes in switch circuits of the first array are disposed substantially adjacent and substantially parallel to source nodes in switch circuits of the second array. When the semiconductor chip and the leadframe device are combined to form a circuit package, a connectivity interface between the semiconductor chip and conductive strips in the circuit package couples each of the source nodes in switch circuits of the first array and each of the multiple source nodes in switch circuits of the second array to a common conductive strip in the leadframe device.

Electrical connectivity for circuit applications

A control circuitry can be configured to receive an error signal indicating a difference between an output voltage of the power supply and a desired setpoint for the output voltage. According to one configuration, depending on the error signal, the control circuitry initiates switching between operating the control circuitry in a pulse width modulation mode and operating the control circuitry in a pulse frequency modulation mode to produce an output voltage. Operation of the control circuitry in the pulse frequency modulation mode during a transient condition, such as when a dynamic load instantaneously requires a different amount of current, enables the power supply to satisfy current consumption by the dynamic load. Subsequent to the transient condition, the control circuitry switches back to operation in the pulse width modulation mode.

Power supply circuitry and adaptive transient control

A voltage converter includes a power stage, a passive circuit, a synchronous rectification (SR) switch component, and a control circuit. The passive circuit couples the power stage to an output node of the voltage converter, and is switchably coupled to ground by the SR switch component. The SR switch component includes a plurality of SR switches, which are independently controllable. The control circuit determines which of the SR switches are to be activated/enabled, and only uses those SR switches in its variable switching of the voltage converter. The determination of which SR switches are to be activated/enabled is based upon an estimate of the output current for the voltage converter. By using more SR switches when the voltage converter is fully loaded, and fewer SR switches when it is lightly loaded, the power loss of the SR switch component is minimized and the voltage converter is more power efficient.

Method and apparatus for efficient switching in semi-resonant power converters

A resonant or semi-resonant voltage converter includes a synchronous rectification (SR) switch through which a current having a half-cycle sinusoidal-like shape is conducted when the SR switch is active. The current through the SR switch is estimated, so that a zero-crossing condition may be detected and used for turning off the SR switch near the optimal point at which zero current is flowing through the SR switch. The current through the SR switch may be estimated based upon a measurement of the current flowing through the SR switch, a measurement of the current flowing out from the secondary side of a transformer in the voltage converter, or a measurement corresponding to the current flowing into the primary side of the transformer.

Current sensing and zero-cross detection in semi-resonant voltage converters

A hybrid power supply circuit includes a digital circuit, a digital-to-analog converter circuit, and an analog compensator circuit (analog control circuit). According to one configuration, the digital circuit includes a digital pre-filter that substantially matches settings of analog filter circuitry present in the analog compensator circuit. During operation, the digital circuit receives control input indicating how to control a magnitude of an output voltage produced by the power supply circuit. The digital circuit passes the received through the digital pre-filter to produce a (filtered) digital reference voltage. The digital-to-analog converter circuit converts the received digital reference voltage into an analog reference voltage (a filtered rendition of the received control input). The analog compensator circuit receives and uses the digitally pre-filtered analog reference voltage as a basis to control the magnitude of the output voltage produced by the power supply circuit.

Pre-filtering in a power supply control circuit

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Andover, MA, United States of America

Robert T Carroll