Corning Incorporated

Corning Cable Systems

Robert Stephen Wagner

Garrett Andrew Piech

Sergio Tsuda

Sasha Marjanovic

Albert Roth Nieber

Stephan Lvovich Logunov

Dana Craig Bookbinder

Natesan Venkataraman

David Andrew Pastel

James Joseph Watkins

Shyamala Shanmugam

Moussa N'Gom

Pushkar Tandon

Xinghua Li

Kamjula Pattabhirami Reddy

Helmut Schillinger

Zsigmond Varga

Carlos Alberto Pons Siepermann

James Joseph Price

Jeffrey Dean Danley

Alranzo Boh Ruffin

Johannes Moll

Christopher William Drewnowski

Thomas Hackert

Aiyu Zhang

Ljerka Ukrainczyk

Venkata Adiseshaiah Bhagavatula

Yuhui Jin

Sean Matthew Garner

James Andrew West

Michael Thomas Gallagher

Seldon David Benjamin

Joel P Carberry

Lu Zhang

Jeffery Alan DeMeritt

Thomas Michael Cleary

Mark Stephen Friske

Peter Knowles

Irene Mona Peterson

Mark Lawrence Powley

John Himmelreich

Aric Bruce Shorey

Ekaterina Aleksandrovna Kuksenkova

David Matthew Berg

Steven S Rosenblum

Jose Mario Quintal

Nathaniel David Wetmore

Keith James Becken

Nicholas Ryan Wheeler

Daniel Wayne Levesque, Jr

Chad Michael Wilcox

Scott Michael Jarvis

Gregory E Williams

Jerry Lee Hepburn

Ronald Lee Burt

Thomas Roger Cook

Daniel Schnitzler

Andres Covarrubias Jaramillo

Percil Watkins

David V Hayes

Franziska L Lorey

William J Chervenak

Andrea Nichole Yeary

Geunsik Lim

Frank Andrew Kramer, Iv

Paul A Sachenlk

Frank Andrew Iv Kramer

Carlos Pons Siepermann

Carlos A Pons Siepermann

The present invention relates to a laser cutting technology for cutting and separating thin substrates of transparent materials, for example to cutting of display glass compositions mainly used for production of Thin Film Transistors (TFT) devices. The described laser process can be used to make straight cuts, for example at a speed of &#x3e;0.25 m/sec, to cut sharp radii outer corners (&#x3c;1 mm), and to create arbitrary curved shapes including forming interior holes and slots. A method of laser processing an alkaline earth boro-aluminosilicate glass composite workpiece includes focusing a pulsed laser beam into a focal line. The pulsed laser produces pulse bursts with 5-20 pulses per pulse burst and pulse burst energy of 300-600 micro Joules per burst. The focal line is directed into the glass composite workpiece, generating induced absorption within the material. The workpiece and the laser beam are translated relative to each other to form a plurality of defect lines along a contour, with adjacent defect lines have a spacing of 5-15 microns.

Laser cutting and processing of display glass compositions

Disclosed herein are glass articles coated on at least one surface with an electrochromic layer and comprising minimal regions of laser damage, and methods for laser processing such glass articles. Insulated glass units comprising such coated glass articles are also disclosed herein.

Electrochromic coated glass articles and methods for laser processing the same

Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.

Method for rapid laser drilling of holes in glass and products made therefrom

A method of printing a 3D object includes feeding one or more preformed materials from a feed outlet into a build zone in which a hot spot is located and using the hot spot to selectively heat the one or more preformed materials to a viscous state. Object layers are formed by depositing portions of the preformed materials on a build surface, or on another object layer on the build surface, while effecting relative motion between the build surface and the feed outlet.

Method and system for printing 3D objects

Disclosed herein are light guide plates (&#x2033;) comprising a transparent substrate () having an edge surface (), a light emitting first major surface (), and an opposing second major surface (); and a polymeric film () disposed on at least one of the first () and second () major surfaces of the transparent substrate, wherein the polymeric film () comprises a plurality of microstructures () and/or a plurality of light extraction features. At least one light source () may be coupled to the edge surface () of the transparent substrate (). Display and lighting devices comprising such light guide plates are further disclosed, as well as methods for manufacturing such light guide plates.

Microstructured and patterned light guide plates and devices comprising the same

Strengthened glass articles having laser etched features, electronic devices, and methods of fabricating etched features in strengthened glass articles are disclosed. In one embodiment, a strengthened glass article includes a first strengthened surface layer and a second strengthened surface layer under a compressive stress and extending from a first surface and a second surface, respectively, of the strengthened glass article to a depth of layer, and a central region between the first strengthened surface layer and the second strengthened surface layer that is under tensile stress. The strengthened glass article further includes at least one etched feature formed by laser ablation within the first surface or the second surface having a depth that is less than the depth of layer and a surface roughness that is greater than a surface roughness of the first surface or second surface outside of the at least one etched feature.

Strengthened glass articles having etched features and methods of forming the same

The present disclosure relates to a process for cutting and separating arbitrary shapes of thin substrates of transparent materials, particularly tailored composite fusion drawn glass sheets, and the disclosure also relates to a glass article prepared by the method. The developed laser method can be tailored for manual separation of the parts from the panel or full laser separation by thermally stressing the desired profile. The self-separation method involves the utilization of an ultra-short pulse laser that can be followed by a COlaser (coupled with high pressure air flow) for fully automated separation.

Laser cut composite glass article and method of cutting

Processes of chamfering and/or beveling an edge of a glass substrate of arbitrary shape using lasers are described herein. Two general methods to produce chamfers on glass substrates are the first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser to create perforations within the glass; followed by an ion exchange.

Edge chamfering methods

An apparatus includes a fiber feeding system to deposit a fiber on an edge of the glass article and a laser system. The laser system is positioned to project a first and a second laser beam onto a first and a second side of the fiber, respectively. The laser system is positioned to project a third laser beam onto the edge of the glass article. A method includes advancing a glass article relative to a fiber; positioning the fiber in relation to an edge of the glass article, contacting a first side of the fiber with a first laser beam, contacting a second side of the fiber with a second laser beam, depositing the fiber on the edge of the glass article, and contacting the edge of the glass article with a third laser beam.

Method and apparatus for sealing the edge of a glass article

Processes of chamfering and/or beveling an edge of a glass or other substrate of arbitrary shape using lasers are described herein. Three general methods to produce chamfers on glass substrates are disclosed. The first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser. Treatment with the ultra-short laser may be optionally followed by a COlaser for fully automated separation. The second method is based on thermal stress peeling of a sharp edge corner, and it has been demonstrated to work with different combination of an ultrashort pulse and/or COlasers. A third method relies on stresses induced by ion exchange to effect separation of material along a fault line produced by an ultra-short laser to form a chamfered edge of desired shape.

Methods are provided for laser processing arbitrary shapes of molded 3D thin transparent brittle parts from substrates with particular interest in substrates formed from strengthened or non-strengthened Corning Gorilla&#xae; glass (all codes). The developed laser methods can be tailored for manual separation of the parts from the panel or full laser separation by thermal stressing the desired profile. Methods can be used to form 3D surfaces with small radii of curvature. The method involves the utilization of an ultra-short pulse laser that may be optionally followed by a COlaser for fully automated separation.

Processing 3D shaped transparent brittle substrate

Articles including a glass-based substrate with holes, semiconductor packages including an article with holes, and methods of fabricating holes in a substrate are disclosed. In one embodiment, an article includes a glass-based substrate having a first surface, a second surface, and at least one hole extending from the first surface. The at least one hole has an interior wall having a surface roughness Rthat is less than or equal to 1 &#x3bc;m. The at least one hole has a first opening having a first diameter that is present the first surface. A first plane is defined by the first surface of the glass-based substrate based on an average thickness of the glass-based substrate. A ratio of a depression depth to the first diameter of the at least one hole is less than or equal to 0.007.

Articles having holes with morphology attributes and methods for fabricating the same

The present invention relates to a process for cutting and separating interior contours in thin substrates of transparent materials, in particular glass. The method involves the utilization of an ultra-short pulse laser to form perforation or holes in the substrate, that may be followed by use of a COlaser beam to promote full separation about the perforated line.

Laser processing of slots and holes

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Corning, NY, United States of America

Robert Stephen Wagner