Flir Systems, Incorporated

Robert Simes

Paul Schweikert

Andrew Sharpe

Gregory A Carlson

Alex Matson

Davey Beard

Robert F Cannata

Richard E Bornfreund

Patrick Franklin

Yaroslava Petraitis

An infrared detector useful in, e.g., infrared cameras, includes a substrate having an array of infrared detectors and a readout integrated circuit interconnected with the array disposed on an upper surface thereof, for one or more embodiments. A generally planar window is spaced above the array, the window being substantially transparent to infrared light. A mesa is bonded to the window. The mesa has closed marginal side walls disposed between an outer periphery of a lower surface of the window and an outer periphery of the upper surface of the substrate and defines a closed cavity between the window and the array that encloses the array. A solder seal bonds the mesa to the substrate so as to seal the cavity.

Wafer level packaging of infrared camera detectors

A microbolometer is disclosed, including a bottom multilayered dielectric, having a first silicon oxynitride layer and a second silicon oxynitride layer disposed above the first silicon oxynitride layer, the first and second silicon oxynitride layers having different refractive indices. The microbolometer further includes a detector layer disposed above the bottom multilayered dielectric, the detector layer comprised of a temperature sensitive resistive material, and a top dielectric disposed above the detector layer.

Multilayered microbolometer film deposition

Growing community of inventors

Santa Barbara, CA, United States of America

Robert Simes