Finisar Corporation

Robert Shih

Chun Lei

John Chen

John Ming-wei Chen

A photonic device package with a passively aligned lens cap is disclosed. The lens cap is positioned with an unobstructed view of the lens portion of the lens cap. A header holding a photonic device, is moved relative to the cap or vice versa until the video display system indicates that the photonic device is aligned to the lens. The cap is held in alignment by forming at least one weld point between the cap and the header. A subsequent hermetic sealing process can be used to permanently seal the cap to the header.

Photonic device package with aligned lens cap

A semiconductor laser formed from a semiconductor wafer has an active layer, at last two optical cladding layers, and a ridge waveguide. A ridge top surface of the ridge waveguide is deposited from a first surface of the semiconductor laser wafer by a first height. A plurality of semiconductor mesas are formed on the semiconductor laser wafer and have mesa top surfaces disposed from the first surface by a second height greater than the first height so that the plurality of semiconductor mesas shield the ridge waveguide from mechanical damage.

Epitaxial layer for laser diode ridge protection

An apparatus for stacking photonic devices is disclosed. The apparatus can include a base, first and second spaced apart rail portions disposed on the base, and a vacuum guide disposed on the base between the rail portions for forming a vacuum gradient that pulls a plurality of photonic devices and spacer bars together into a stack. Optionally, spaced apart photonic device supports can be placed on the base between the rail portions to lift the photonic devices off of the surface of the base. The apparatus can also include a clamping system to hold the stack in place so that a vapor deposition process can be used to apply coatings to the photonic devices. In one exemplary embodiment, the photonic devices can be laser bars.

Apparatus and method for stacking laser bars for uniform facet coating

The present invention relates generally to laser/detector packages, and particularly to laser/detector packages with components that increase the accuracy and ease of laser diode positioning. In particular, the laser/detector package of the present invention includes an attachment plate having a reference surface; a header post that is perpendicular to the reference surface when attached to the reference surface; sub-mount that houses a laser diode and abuts the reference surface or a spacer, which abuts the reference surface. By abutting the reference surface or the spacer, the laser diode attached to the sub-mount is easily and precisely positioned a proper distance from the reference surface. Additionally, preferred embodiments of the invention include a marking on the sub-mount that is parallel to the reference surface and a marking that is perpendicular to the reference surface on the spacer or sub-mount. These markings further improve the ease and accuracy of positioning and repositioning the laser diode and/or sub-mount.

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Arcadia, CA, United States of America

Robert Shih