Raytheon Company

Other

Hughes Aircraft Company

Robert S Miles

Philip A Trask

Vincent A Pillai

James H Schaffner

Daniel Frederic Sievenpiper

Tsung-Yuan Hsu

Gregory L Tangonan

Robert Y Loo

Adele E Schmitz

Gustav A Schmidt

A flexible antenna array comprises a plurality of layers of thin metal and a flexible insulating medium arranged as a sandwich of layers. Each layer of the sandwich is patterned as needed to define: (i) antenna segments patterned in one of the metal layers, (ii) an array of metallic top elements formed in a layer spaced from the the antenna segments, the array of metallic top elements being patterned in another metal layer, (iii) a metallic ground plane formed in a layer spaced from the array of metallic top elements, the metallic ground plane having been formed from still another metal layer, and (iv) inductive elements coupling each of the top elements in the array of metallic top elements with said ground plan. An array of remotely controlled switches are provided for coupling selected ones of said antenna segments together.

Low-cost HDMI-D packaging technique for integrating an efficient reconfigurable antenna array with RF MEMS switches and a high impedance surface

Phase mask laser machining procedures for fabricating high density fine pattern feature electrical interconnection structures. Conductor patterns are fabricated using a phase mask laser patterned dielectric layer as a conductor wet etch masking layer, or by subtractively removing metal using holographic phase mask laser micromachining. In accordance with the present invention, a substrate is provided, a first layer of dielectric material is formed on the substrate, a metal layer is formed on the first layer of dielectric material, and a second layer of dielectric material is then formed on the metal layer. A phase mask is disposed above the second layer of dielectric material that has a predefined phase pattern therein defining a metal conductor pattern that corresponds to an interconnect structure. The second layer of dielectric material is then processed using the phase mask to form the interconnect structure. In a first procedure, the second layer of dielectric material is irradiated through the phase mask using laser energy to remove portions of the second layer of dielectric material and expose the metal layer to define the metal conductor pattern and to provide a dielectric etch mask. Then, the exposed metal layer is wet etched using the dielectric etch mask to form the interconnect structure. A second procedure provides for irradiating the second layer of dielectric material with laser energy through the phase mask to remove portions of the second layer of dielectric material to define a metal conductor pattern. Then, a second metal layer is electrolessly plated, or chemical vapor deposited, in the metal conductor pattern on the exposed surface of the second layer of dielectric material to form the interconnect structure. In a third procedure, the first layer of dielectric material is formed on the substrate, the metal layer is formed thereon, and the phase mask is disposed above the metal layer. The conductor pattern is then directly etched in the metal layer using a laser and the phase mask.

Phase mask laser fabrication of fine pattern electronic interconnect

A three dimensional stack of printed circuit assemblies (10,12) provides electrical interconnection or bussing between layers of the stack by means of a composite contactor (34, 35, 36, 77, 79, 81, 83) formed of a shape-memory core (90) having a number of highly electrically conductive resilient wires (92, 94) wrapped around it. The shape-memory core (90) has a low temperature configuration that is substantially straight and enables the contactor assembly or core (90) and wires (92, 94) to be inserted into vias (30, 31, 76, 78, 80, 82) extending through this stack of layers with little or no insertion force. When heated above its phase change temperature, the shape-memory core (90) assumes a sinuous configuration which tightly presses the encircling conductive wires (92, 94) against the electrically conductive interior surfaces of the vias (30, 31) to provide mechanical and electrical contact from layer to layer.

Shape-memory metal core electrical contactor

Growing community of inventors

Monrovia, CA, United States of America

Robert S Miles