Other

Hughes Aircraft Company

Hughes Electronics Corporation

Sentronics Corporation

He Holdings, Inc.

Robert S Hayes

David M Masarik

Robert W Klatt

Frank N Cheung

Gregory Sechong Um

The ice-removing device is configured to remove ice from the exterior surface of a vehicle. Specifically, the ice-removing device is an apparatus that applies an ice-removing chemical to the exterior surface of the vehicle for the purpose of removing the accumulation of ice on the vehicle. The ice-removing device comprises a reservoir, a hose, a pump, a removal device and a deicing fluid. The pump transports the deicing fluid from the reservoir through the hose to the vehicle. The removal device is a structure that is designed to scrap and move ice that has accumulated on the vehicle. The removal device is mounted on the outlet port of the pump such that the deicing fluid flows through the removal device.

Ice-removing device

The invention is a device for detecting images formed by thermal infrared radiation. It uses a two dimensional array of thermally sensitive elements formed of material whose capacitance changes with temperature. Changes in capacitance of the detector elements are measured and used to form an electronic representation of the thermal infared image. The detector array can be fabricated using inexpensive materials and processes.

Thermal infrared image detector

A low cost capacitive fingerprint sensor which can be fabricated on various substrates, such as large glass or plastic substrates. The sensor is made by depositing and patterning alternate layers of conductive and insulation materials. A pixel of the sensor is comprised of a pick up pad and a plurality of voltage electrodes symmetrically placed around the pick up pad. The symmetry is such that only when a finger surface ridge is present, the pick up pad registers a signal.

Capacitive circuit array for fingerprint sensing

A two dimensional array of electrods for sensing the presence or absence of the ridges in a fingerprint through capacitive measurements. Exciting signals are supplied from outside the array which allows the array to be fabricated from metal and insulator layers on non-semiconductor substrates such as glass or plastic using normal deposition and patterning techniques. A top protective layer consisting of hard, rigid material may be provided. The required electronic circuits are preferably located around the periphery of the array.

Capacitive two dimensional sensor

An interfacing system adapted for use with integrated circuits and accompanying devices. The inventive system includes an array of field emissive devices (36) which emit an electrons in response to input signals from multiple first circuits (14) on a first substrate (16). The field emissive devices (36) are located on the first substrate (16). An array of detectors (38) on a second substrate (20) receive the electrons across a (gap (42) between the first substrate (16) and the second substrate (20). A potential difference in response to a source of potential (22) between the first substrate (16) and the second substrate (20) accelerates the electrons across the vacuum gap (42). The interfacing system (10) may be constructed with a diameter of less than ten micrometers. Hence, two substrates with multiple circuits may be interfaced with many thousands of parallel connections per square centimeter without the need for multiplexing.

Low cost system for effecting high density interconnection between

An image conversion device (14) comprising a detector (38) for detecting an infrared image and an image converter (40) for converting the infrared image to a visible image. The detector (38) and the image converter (40) are disposed on a single substrate. The detector (38) includes an array of multiple quantum well detectors (38) formed of GaAs or GaAlAs. The image converter (40) includes an array of light emitting diodes formed of GaAsP deposited on the array of multiple quantum well detectors (38). A photoemissive surface (28) is formed on the array of light emitting diodes (40) and a phosphor screen (30) displays the visible image.

Infrared to visible light image conversion device

An analog signal processor for use with an array of uncooled detectors. Each detector has an amplifier associated therewith and each amplifier provides gain. A first circuit (212, 294, 300, 220) is included for compensating for a DC offset of each detector/amplifier pair of the array. A second circuit (250, 294, 300) corrects for variations in the sensitivity of each detector/amplifier pair. As a result, the outputs each of the detector/amplifier pairs in response to a common input signal are equalized. In a specific implementation, additional circuits are included providing global automatic DC level control across the array (270, 280, 294, 300), global automatic gain control across the array (250, 262, 294, 300) and frame-to-frame offset adjustment (212, 230).

Signal processor for infrared camera

A digital signal processing system (100) removes DC bias in the output of a pyroelectric detector and similar types of detectors by adding together a first output signal which is inverted and a second output signal which is not inverted. The system (100) also removes offsets in the detector signal introduced by electronic circuits (readouts, amplifiers, drivers, etc.) between the detector and the system (100).

Digital signal processing system for removing DC bias in the output of

An automatic gain and level control output circuit. The inventive circuit (10) includes a first component (12) for multiplying an input signal by a first reference signal to provide a gain adjusted signal. The input signal is level shifted by a second reference signal by a second component (16) to provide a level adjusted signal. The gain and level adjusted signals are compared to third and fourth reference signals by third and fourth components (26 and 28), respectively. The outputs of the third and fourth components (26 and 28) are combined to provide a first signal. Either the output of the third component (26) or the fourth component (28) is selected to provide a second signal having a first or a second level respectively. The first signal is integrated to provide the first reference signal and the fourth signal is integrated to provide the second reference signal.

Automatic gain and level control circuit and method

A high resolution gain response correction circuit. The inventive circuit (10) is adapted for use with a first circuit for providing a first analog input signal and includes a second circuit (R.sub.p, R.sub.ref) for providing a second input signal in response to the first input signal. A third circuit (12) is included for providing an analog output signal in response to the first and second input signals. In a particular implementation, the third circuit is a digital-to-analog converter (12). The digital-to-analog converter (12) is adapted to adjust the output signal level in response to an individual pixel correction reference signal. A digital potentiometer (R.sub.p) allows for the first input signal to be scaled and used to adjust the level of the second input signal. By adjusting the setting of the potentiometer, the dynamic range of the output to the digital-to-analog converter may be adjusted. Hence, the inventive arrangement allows for the gain correction range of a digital-to-analog converter to be matched to a particular array under test via software control.

High resolution gain response correction circuit

An automatic gain and level control method and circuit. In general, the inventive method includes the steps of detecting the DC level of a signal and providing a first signal in response thereto and detecting the AC amplitude or gain of the signal and providing a second signal in response thereto. A DC level error signal is generated in response to the first signal. An AC amplitude error signal is generated in response to the second signal. The DC level of the signal is corrected in response to the DC level error signal. The AC amplitude of the signal is corrected in response to the AC amplitude error signal.

A subdividing structure is fitted and secured within and disposed at the bottom of a carton, box, package of similar container structure to receive and position within the container road flares for transportation storage and use. The subdividing structure is constructed either from interfitting members which together form an 'egg crate' like set of compartments, one for each flare or from high density foam formed with a plurality of spaced compartments. The subdividing structure compartments are each of a size and configuration to hold a single flare and of a height such that the ends of the wire support for the respective flares are disposed above the top of the subdividing structure so that the wire ends do not trap the flares in their respective compartments or otherwise hinder removal of the flares from their respective compartments. The container is formed in box-like configuration from cardboard, box-board, plastic or the like and of a size and configuration to receive the subdividing structure and road flares when disposed therewithin. The upper lip of the container is at a height so that when the container is open the tops of the road flares are readily accessible.

Subdivided flare-holding container

An automatic chimney fire extinguisher and method includes a housing for insertion in a chimney at the outlet thereof and a flare in the housing connected thereto by a cord to suspend the flare below the housing at a predetermined distance. The flare is releasably retained in the housing and the extinguisher is responsive to a preselected temperature level in the chimney for releasing the flare to permit same to drop below the housing and to be suspended by the cord. The flare is ignited in response to the release thereof.

Growing community of inventors

Lawndale, CA, United States of America

Robert S Hayes