Atotech Deutschland Gmbh

Atotech Deutschland Gmbh & Co. Kg

Robert Rüther

Olaf Kurtz

Jürgen Barthelmes

Tse-Cheen Foong

Joko Setyadi-Lie

Josef Gaida

Din-Ghee Neoh

Thomas Moritz

Christian Wunderlich

Florence Lagorce-Broc

Sia-Wing Kok

Nadine Menzel

Jana Breitfelder

Oleg Sprenger

Michael Danker

Marta Sainz-Vila

Nina Dambrowsky

Chee-Chow Tan

Jen Joo Lim

Markus Gloeden

Herko Genth

Anthony Mcnelly

The present invention relates to an aqueous passivation solution having a pH in the range from 5.4 to 7.2, the solution including

Method for electrolytically passivating a surface of silver, silver alloy, gold, or gold alloy

A method for electrolytically passivating a surface of silver, silver alloy, gold, or gold alloy, the method comprising the steps of

A method for electrodepositing a metal layer from an electrolytic bath is described, wherein the concentrations of at least two components of the electrolytic bath are monitored by carrying out the following steps: (a) a sample is taken from the electrolytic bath; (b) the sample is supplied to a column for solid phase extraction, which contains a solid sorbent material; (c) the column is subjected to a washing procedure with a first eluent, wherein the at least two components remain on the column, and undesired components are eluted from the column; (d) the at least two components are eluted from the column by a second eluent; (e) the concentrations of the at least two components in the eluate obtained in step (d) are determined without separating the components from each other. In this method the use of poly(divinyl benzene-co-N-vinyl pyrrolidone) for solid phase extraction is particularly advantageous.

Electrodeposition method with analysis of the electrolytic bath by solid phase extraction

The invention addresses the problem of improving the adhesion between silver surfaces and resin materials, such as epoxy resins and mold materials, used in the production of electronic devices. The invention provides a method for improving the adhesion between a silver surface and a resin material comprising a step of electrolytically treating the silver surface with a solution containing a hydroxide selected from alkali metal hydroxides, alkaline earth metal hydroxides, ammonium hydroxides and mixtures thereof, wherein the silver surface is the cathode. In a particular embodiment of this method, the present invention provides a method for producing a surface mounted electronic device comprising the following steps: (i) providing a lead frame having copper and silver surfaces, (ii) electrolytically treating the silver surfaces of the lead frame with a solution containing a hydroxide selected from alkali metal hydroxides, alkaline earth metal hydroxides, ammonium hydroxides and mixtures thereof, wherein the lead frame is the cathode, (iii) encapsulating an electronic device together with the lead frame using a resin material.

Method for improving the adhesion between silver surfaces and resin materials

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Oranienburg OT Lehnitz, Germany

Robert Rüther