Lockheed Martin Corporation

Robert Richard Pearson

Marc Thomas Angelucci

Anthony Jonathan Bednarz

Ilya Gershkovich

Alexander John Silverman

A semiconductor package is provided. The semiconductor package includes a segmented inset lid that is divided into a primary component and one or more secondary components, with each secondary component being coupled to the primary component by a compliant liquid-tight adhesive; wherein the primary component is a continuous region including i) a first surface, ii) a second surface, and iii) a boundary surface, the first surface including one or more integrated heat sink surfaces or one or more routing features to promote coolant distribution, the second surface contacting one or more semiconductor dies, and the boundary surface forming a sealing surface with a semiconductor substrate; wherein each secondary component contacts at least one other semiconductor die and forms a water-tight seal with the primary component; and a removable flow cover coupled with the segmented inset lid to form a seal along the boundary surface.

Semiconductor package with liquid flow-over segmented inset lid

A mounting system for functionally-coupling a line-replaceable unit with a structural manifold for supplying fluid coolant can comprise a fastener for the line-replaceable unit having a base and a projection. The projection can have a proximal portion and a distal portion, where the fastener is at least partially-threaded along the projection, and a plurality of seals are disposed radially along the projection. A channel can extend along a longitudinal axis of the fastener from the distal portion of the projection toward the proximal portion of the projection. One or more outlets can be disposed along the projection, the one or more outlets providing fluid communication between the channel and an external environment of the fastener. The fastener can be reversibly-coupled to a mating fastener of the structural manifold such that, when coupled, the line-replaceable unit is rigidly coupled to the structural manifold and fluid is able to flow therebetween.

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Philadelphia, PA, United States of America

Robert Richard Pearson