Melexis Technologies Sa

Sentron Ag

Melexis Technologies Nv

Electrowatt Technology Innovation Ag

Asahi Kasei Emd Corporation

Melexis Tessenderlo N.v.

Interglass Technology Ag

Maglab Gmbh

Robert Racz

Jian Chen

Bruno Boury

Radivoje Popovic

Radivoje S Popovic

Mathieu Ackermann

Christian Schott

Samuel Huber

Hubert Blanchard

Alexandre Pauchard

Antonio Cacciato

Javier Bilbao De Mendizabal

Simon Houis

Jens Krause

Jan Hrejsa

Jan-Willem Burssens

Laurent Coulot

Antonino Cacciato

Yo Yamagata

Koji Shibahara

Peter Krummenacher

Guido Dupont

Markus Gloor

Mathieu Gallot

Reinoud Felix Wolffenbuttel

Adrian Flanagan

Dragan Manic

Amalia Spataru

Michael Triulzi

Angelo Manco

Michael Burmeister

A current sensor system for measuring an AC electrical current, includes: an electrical conductor portion for conducting the AC current and generating a first magnetic field; a U-shaped magnetic shielding partially surrounding said electrical conductor portion, and having a central shielding portion and two shielding leg portions; a metal plate or a metal layer arranged at a distance from the shielding legs portions for allowing eddy currents to flow and for generating a second magnetic field; a magnetic sensor device arranged between the conductor portion and the metal plate or metal layer, and between the shielding leg portions, configured for measuring a magnetic field component. The sensor system likewise includes a three-phase current sensor system.

Current sensor system

A circuit for sensing a current comprises a substrate having a first and a second major surface, the second major surface being opposite to the first major surface. At least one magnetic field sensing element is arranged on the first major surface of the substrate and is suitable for sensing a magnetic field caused by a current flow in a current conductor coupled to the second major surface. The substrate also comprises at least one insulation layer, substantially buried between the first major surface and the second major surface of the substrate.

Insulated current sensor

The present invention relates to a current-sensor structure comprising a conductor for conducting electrical current in a current direction. The conductor has one or more conductor surfaces. At least one current sensor is disposed on, over, adjacent to or in contact with the conductor and is offset from a centre of the conductor in an offset direction orthogonal to the current direction and optionally parallel to a conductor surface. The current-sensor structure can comprise a substrate on which the conductor is disposed. The current sensor can be located on a side of the conductor opposite or orthogonal to a surface of the substrate. The current sensor can be aligned with, near to or adjacent to an edge of the conductor. The current-sensor structure can comprise a shield, such as a U-shaped laminated shield that at least partially surrounds the conductor and the current sensor.

Offset current sensor structure

A sensor device comprising a substrate, the substrate comprising one or more magnetic sensor elements; a first elastomeric material on top of the one or more magnetic sensor elements; a magnetic layer comprising a soft magnetic metal alloy deposited by electroplating or by sputtering on top of the first elastomeric material; and optionally a second elastomeric material on top of the magnetic layer. The substrate may be a CMOS device with IMC encapsulated between two polyimide layers. The magnetic material may be annealed at 250&#xb0; C. to 295&#xb0; C. using a constant or rotating magnetic field having a strength in the range from 100 to 300 mTesla. The soft magnetic alloy is arranged as Integrated Magnetic Concentrator (IMC).

Sensor device with a soft magnetic alloy having reduced coercivity, and method for making same

A two-dimensional magnetic field sensor comprises a support, a single magnetic field concentrator which consists of at least three parts which are separated from each other by gaps, and at least two magnetic sensor elements. The magnetic sensor elements are arranged in the region of the edge of the magnetic field concentrator. No magnetic sensor element is present in the gaps.

Two-dimensional magnetic field sensor with a single integrated magnetic field concentrator

A current sensor comprises a current conductor having a first portion, a measuring portion and a second portion, the first portion including one or more first electrical terminals and the second portion including one or more second electrical terminals. The current sensor further comprises third electrical terminals and a semiconductor chip. The semiconductor chip has one or more magnetic field sensors disposed in the active surface, is mounted on the current conductor with an active surface facing the current conductor. The active surface comprises first contacts. The semiconductor chip comprises electrical through silicon connections disposed over and electrically connected to the first contacts. A backside of the semiconductor chip comprises second contacts, each of the second contacts electrically connected to one of the electrical through silicon connections. Wire bonds electrically connect the second contacts with the third electrical terminals.

Current sensor and method of making a current sensor

A one-dimensional magnetic field sensor comprises a support, a single elongated magnetic field concentrator or two magnetic field concentrators, which are separated by a first gap, and at least one magnetic sensor element. The magnetic field concentrator, or both thereof, consists of at least two parts which are separated from each other by second gaps. A two-dimensional magnetic field sensor comprises a support, a single magnetic field concentrator which consists of at least three parts which are separated from each other by gaps, and at least two magnetic sensor elements.

Magnetic field sensor with integrated field concentrators

A method of making a current sensor is described. The method includes providing a leadframe having a current conductor portion comprising two sections shaped such that a current to be measured flows in directions oriented obliquely or oppositely with respect to each other. Further, the method includes deforming the leadframe to lower the current conductor portion, and mounting an isolator on the current conductor portion. The method also includes mounting a semiconductor chip having a thickness of at least 0.2 mm and comprising two magnetic field sensors composed of four Hall sensors and magnetic field concentrators on the isolator, connecting the semiconductor chip and sensor terminal leads by wire bonds, packaging the semiconductor chip and parts of the leadframe in a plastic housing, and cutting a frame of the leadframe from current terminal leads and the sensor terminal leads.

Method of making a current sensor and current sensor

The invention relates to a method for the production of current sensors which comprise a plastic housing made in an IC technology. The key steps are to mount on a leadframe and wire bond semiconductor chips having Hall sensors, to place the leadframe in an injection mold, to close the injection mold with a first mold insert and to inject plastic material, wherein each semiconductor chip is packed into an intermediate casing including a flat surface having alignment structures. Then the injection mold is opened and a current conductor section is placed on the flat surface of each intermediate casing, the current conductor section having counter structures matching the alignment structures so that it is automatically aligned and held. Then the injection mold is closed with a second mold insert and plastic material injected to form the final housing of the current sensors. It is also possible to use two different injection molds.

Method of making current sensors

A device for current measurement comprises a substrate with a first current conductor and a current sensor with a second current conductor. The current sensor is mounted above the first current conductor on the substrate. The second current conductor is formed with integrally attached first and second terminal leads through which the current to be measured is supplied and discharged. The current sensor further comprises a semiconductor chip with a magnetic field sensor mounted on the second current conductor on the side of the second current conductor facing the substrate. The magnetic field sensor is sensitive to a component of the magnetic field extending parallel to the surface of the semiconductor chip and perpendicular to the second current conductor. The second current conductor extends above and parallel to the first current conductor.

Device for current measurement

A current sensor comprises a housing of plastic, a current conductor with integrally shaped first and second electrical terminals, through which a current to be measured is supplied and discharged, third electrical terminals, and a semiconductor chip having at least one magnetic field sensor, which is sensitive to a component of the magnetic field generated by the current flowing through the current conductor running perpendicularly to the surface of the semiconductor chip. The first and second electrical terminals are arranged at a first side of the housing, the third electrical terminals are arranged at a side of the housing opposite to the first side. The semiconductor chip is mounted as flip chip. The semiconductor chip comprises first bumps, which make electrical connections to the third terminals, and second bumps located above the current conductor and electrically separated from the semiconductor chip by an isolation layer.

Current sensor

A current sensor comprises a flat housing made of plastic having an underside and an upper side and electrical connections, a current conductor through which the current to be measured flows, and a semiconductor chip having two magnetic field sensors, wherein the component of the magnetic field detected by the two magnetic field sensors points in opposite directions at the locations of the two magnetic field sensors. The semiconductor chip is connected as flipchip to the electrical connections. The current conductor extends from one side wall to the opposite side wall of the housing, is embedded flat in the underside of the housing and is therefore exposed on the underside of the housing. The opposing surfaces of the semiconductor chip and the current conductor are separated by an electrical insulation layer.

A device for measuring a current flowing through an electric cable comprises a printed circuit board, a magnetic field sensor and a ferromagnetic component. The ferromagnetic component comprises two tongues whose front faces are disposed opposite of each other and are separated by an air gap and further comprises at least two feet, with the tongues and/or the feet being bent off. The cable is guidable through an opening which is enclosed by the ferromagnetic component. The ferromagnetic component and the magnetic field sensor are mounted on a surface of the printed circuit board. The magnetic field sensor is sensitive to a magnetic field extending parallel to the surface of the printed circuit board. The tongues of the ferromagnetic component extend parallel to the surface of the printed circuit board ().

Device for measuring a current flowing through an electric cable

A magnetic structure for detecting a relative motion between the magnetic structure and a magnetic field sensor comprises at least two permanent magnets. The permanent magnets are arranged along a predetermined line which for example is a straight or circular line at a predetermined distance g from each other. The permanent magnets are magnetized in the direction of the line, adjacent permanent magnets having an opposite direction of magnetization.

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Zug, Switzerland

Robert Racz