Ppg Industries, Inc.

Ppg Industries Ohio, Inc.

Robert R Zwack

Gregory J McCollum

Robert D Jerabek

Victor G Corrigan

Roger M Christenson

Venkatachalam Eswarakrishnan

Joseph R Marchetti

Steven R Zawacky

Edward R Coleridge

Roger L Scriven

V Eswarakrishnan

Ellor James Van Buskirk

Raphael O Kollah

Donald W Boyd

Matthew S Scott

George W Mauer

Neil D McMurdie

Gerald W Gruber

Philippe Faucher

Michael A Polack

Michael J Pawlik

Craig A Wilson

James E Poole

Thomas C Moriarity

Chester J Szymanski

Richard F Syput

Michael L White

Thomas Palaika

Keith S Ritter

An electrodeposition process is provided for applying an elastomeric thermosetting, film-forming polymer to a corrosion-resistant electrically conductive substrate that is free of an electrodeposited coating. The elastomeric polymer typically is a polyurethane, a polyurea or a poly(urethane urea). The film-forming coating applied by this process provides chip resistance to the substrate. A coated article that is prepared according to the process is also provided.

Article having a chip-resistant electrodeposited coating and a process for forming an electrodeposited coating

A process for applying two electrodeposited coatings, one on top of the other, to an electrically conductive substrate is provided. An electrically conductive first coating is applied to provide for corrosion resistance and a second polyurethane-based coating is applied to the first coating to provide chip resistance. Also, aqueous dispersions of the polyurethane coating compositions are disclosed.

Process for forming a two-coat electrodeposited composite coating the composite coating and chip resistant electrodeposited coating composition

Disclosed is an improved electrodeposition bath composition which is comprised of a resinous phase dispersed in an aqueous medium, the resinous phase comprising an active hydrogen group-containing cationic electrodepositable resin and a curing agent having functional groups reactive with the active hydrogen groups of the resin. The improvement comprises the inclusion in the electrodeposition bath composition of an organic phosphorous-based compound of specific structures. The electrodeposition bath compositions provide excellent corrosion resistance to electrocoated substrates, particularly untreated steel, and reduced corrosivity of the acidic cationic electrodeposition bath to steel equipment and pipes. Also disclosed is a method of electrocoating a conductive substrate using the improved electrodeposition bath compositions of the invention. Metallic substrates coated by this method are also disclosed.

Electrodeposition baths containing organic phosphorous-based compounds

In accordance with the present invention, an electrodepositable composition and a method of electrodeposition using the composition are provided. The electrodepositable composition comprises (a) an active hydrogen-containing, cationic salt group-containing resin electrodepositable on a cathode; (b) a capped polyisocyanate curing agent; and optionally, (c) a metal-containing catalyst. The capped polyisocyanate curing agent comprises a polyisocyanate at least partially capped with a material having the structure: ##STR1## wherein n is a number of 1 to 10; m is a number of 1 to 10 and R is hydrogen or an alkyl or aryl group or substituted alkyl or aryl group having from about 1 to about 30 carbon atoms.

Electrodepositable coating compositions and their use in a method of

An electrodepositable composition is provided comprising (a) an active hydrogen-containing, cationic salt group-containing resin electrodepositable on a cathode; (b) a capped polyisocyanate curing agent; and (c) bismuth diorganodithiocarbamate. Such compositions may be prepared without the use of conventional lead or tin catalysts and exhibit excellent properties as cured coatings. Also provided is a method of electrocoating an electroconductive substrate using the composition of the present invention.

Electrodepositable coating composition containing bismuth

An improved electrodepositable composition is provided comprising: (a) an active hydrogen-containing cationic resin electrodepositable on a cathode; (b) a capped polyisocyanate curing agent; and (c) an organotin-containing catalyst. The improvement comprises the addition to the electrodepositable composition of a water immiscible acid functional compound having a hydrocarbon chain of at least 5 carbon atoms. The composition provides improved cure response and appearance properties when electrodeposited over conductive substrates.

Electrodepositable coating compositions having improved cure response

An electrodepositable composition is provided comprising: (a) active hydrogen-containing, cationic salt group-containing resin electrodepositable on a cathode; (b) at least one at least partially capped polyisocyanate curing agent; (c) at least one metal-containing catalyst; and (d) at least one material having the following general formula: ##STR1## wherein R.sub.1 is alkyl or substituted alkyl having 1 to 18 carbon atoms or aryl or substituted aryl; and R.sub.2 is hydrogen, alkyl or substituted alkyl having 1 to 18 carbon atoms or aryl or substituted aryl. The composition can demonstrate enhanced corrosion resistance at low metal catalyst levels without loss of cured film properties or appearance when electrodeposited and cured over conductive substrates.

Electrodepositable coating compositions containing hydroxamic acid and

An improved electrodepositable composition is provided comprising: (a) an active hydrogen-containing cationic resin electrodepositable on a cathode; (b) a capped polyisocyanate curing agent; and (c) an organotin-containing catalyst. The improvement comprises the addition to the electrodepositable composition of a water immiscible acid functional compound having a hydrocarbon chain of at least 5 carbon atoms like abietic acid and natural sources thereof. A preferred acid functional compound is abietic acid. The composition provides improved cure response and appearance properties when electrodeposited over conductive substrates.

Electrodepositable coating compositions and method for improved cure

An electrodepositable composition is provided comprising (a) an active hydrogen-containing, cationic salt group-containing resin electrodepositable on a cathode; (b) a capped polyisocyanate curing agent; and (c) a diorganotin dicarboxylate; wherein the dicarboxylate is at least one long chain carboxylate having from 14 to 22 carbon atoms and the diorganotin dicarboxylate is present in the electrodepositable composition in an amount of at least 0.01 percent by weight tin based on weight of total solids of the electrodepositable composition. The composition provides improved storage stability without precipitation of dibutyltin oxide, and when electrodeposited over conductive substrates, there is no loss of cure response and appearance properties.

Electrodepositable coating composition containing diorganotin

Electrodepositable primer compositions comprising an aqueous dispersion of an ionic epoxy-based resin, a hindered amine light stabilizer and an antioxidant mixture which comprises a phenolic antioxidant and a sulfur-containing antioxidant. The primer compositions find particular use under topcoats which are permeable to UV radiation which, in the absence of the hindered amine and antioxidant mixture, causes delamination of the topcoat from the primer coat.

Photodegradation-resistant electrodepositable primer compositions

An electrodepositable primer composition having improved delamination resistance with regard to automotive topcoats is disclosed. The composition is particularly useful in conjunction with topcoats which transmit ultraviolet radiation. The composition includes an ionic resin and a hindered amine light stabilizer (HALS) which is preferably a hindered aminoether light stabilizer. A preferred hindered aminoether light stabilizer is bis-(1-octyloxy-2,2,6,6-tetramethyl-4-piperidinyl)sebacate. The invention also includes a process for coating a substrate by applying the above-described primer composition and subsequently applying a topcoat. The process can alternatively include applying a standard primer composition to a substrate and subsequently applying a HALS compound to the electrodeposited substrate.

Electrodepositable compositions comprising active hydrogen-containing ionic resins, capped polyisocyanate curing agents and triorganotin catalysts are disclosed. The catalysts are liquid, can be easily incorporated into the electrodepositable compositions and surprisingly exhibit good catalytic activity at low levels.

Electrodepositable compositions containing triorganotin catalysts

A high throw power electrodeposition system with improved rupture voltage is disclosed. The electrodepositable coating includes an active hydrogen-containing ionic resin and a gamma hydroxy urethane curing agent, such as a curing agent having the structural feature: ##STR1## The gamma hydroxy urethane curing agent can be prepared by reacting a polyisocyanate with a 1,3-polyol, and in particular with 2,2,4-trimethylpentane-1,3-diol. The composition can also include a curing agent having an alkyl urethane structural feature which can be the reaction product of a polyisocyanate and a blocking agent which is a fatty alcohol. A method for coating a conductive substrate with the above-described composition is also disclosed. The method includes passing an electric current between the conductive substrate serving as a first anode and a second anode to deposit the composition and the conductive substrate.

High throw power electrodeposition system

Cationic electrocoating compositions comprising a cationic electrodepositable resin and particular hydroxyl-free, alkylated polyethers dispersed in an aqueous medium are disclosed. Due to the presence of the polyethers, the compositions electrodeposit at high film builds with good smoothness. However, the polyethers do not result in detrimental effects with regard to the properties of the compositions such as rupture voltage and corrosion resistance of the resultant electrodeposited film. Also, the particular polyethers readily incorporate in the electrodeposition bath, are non-volatile and do not significantly build up in the electrodeposition bath during the electrodeposition process.

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Allison Park, PA, United States of America

Robert R Zwack