International Business Machines Corporation

Other

Robert R Shaw

George Frederick Walker

Jungihl Kim

Young-Ho Kim

Thomas M Shaw

Emanuel Israel Cooper

Shaji Farooq

Sarah Huffsmith Knickerbocker

Robert Anthony Rita

Rao Venkateswara Vallabhaneni

John J Ritsko

Gordon J Robbins

Peter Richard Duncombe

Jae M Park

David T Shen

Mark O Neisser

Joseph C Logue

Farid Youssif Aoude

Antonio R Gallo

Edward A Giess

Friedel Muller-Landau

Jon A Van Hise

James M Brownlow, Deceased

Charles Hampton Perry

Steven D Gregory

Kung-Shiuh Huang

James J McDonough

An efficient light coupling apparatus for interconnecting two optical components. Light radiation from the first optical component, for example an optical light fiber is directed onto the plane surface of the second optical component, for example a passive waveguide. The light is directed onto the second optical component at a convenient angle such that it impinges on the plane surface of the second optical component at an incident angle. An angularly selective coupling means, for example a volume hologram is located between the first and second optical components for coupling a maximum amount of the light at the incident angle.

Optical interconnect in optical packages using holograms

A method of clocking integrated circuit chips. A pulsed laser striking an integrated circuit module substrate is diffused through the substrate and exits the opposite surface as diffused light pulses. An integrated circuit chip mounted on the top surface of the substrate has optical receivers. The optical receivers receive pulsed energy from the diffused light pulses, converting pulsed light to electrical pulses that clock the chip.

Method of clocking integrated circuit chips

Improved vie-filling compositions for producing conductive vias in circuitized ceramic substrates, particularly multi-layer substrates, without cracking and/or loss of hermetic sealing. The via-filling compositions comprise pastes containing a mixture of (a) ceramic and/or glass spheres of substantially- uniform diameter between about 0.5 and 6 .mu.m, (b) conductive metal particles or spheres having a maximum dimension or diameter between about 1/3 and 1/4 of the diameter of the ceramic and/or glass spheres, and (c) a binder vehicle. The formed conductive via bodies comprise a uniform conductive skeletal network of sintered metal particles densely packed within a uniform matrix of the co-sintered ceramic and/or glass spheres, which matrix is hermetically fused and integrated with ceramic layers forming the wall of the via in the ceramic circuit substrate.

Process for producing ceramic circuit structures having conductive vias

A waveguide structure is directly extruded onto a surface from a nozzle placed a predetermined distance above the surface and which is moved relative to the surface, preferably by means of a translation table. The predetermined distance is preferably maintained constant and the speed of relative motion regulated to achieve a uniform degree of molecular orientation within the extruded material, thus maintaining a sufficiently uniform refractive index along the axis of the waveguide. Partitions within the nozzle allow the formation of a layered waveguide or the simultaneous formation of concentric cladding or protective layers. The waveguides are advantageously formed as a curtain which is later patterned, by direct writing on the surface or between chips mounted on an electronic module.

Extrusion of polymer waveguides onto surfaces

Improved via-filling compositions for producing conductive vias in circuitized ceramic substrates, particularly multilayer substrates, without cracking and/or loss of hermetic sealing. The via-filling compositions comprise pastes containing a mixture of (a) ceramic and/or glass spheres of substantially- uniform diameter between about 0.5 and 6 .mu.m, (b) conductive metal particles or spheres having a maximum dimension or diameter between about 1/3 and 1/4 of the diameter of the ceramic and/or glass spheres, and (c) a binder vehicle. The formed conductive via bodies comprise a uniform conductive skeletal network of sintered metal particles densely packed within a uniform matrix of the co-sintered ceramic and/or glass spheres, which matrix is hermetically fused and integrated with ceramic layers forming the wall of the via in the ceramic circuit substrate.

Via paste compositions and use thereof to form conductive vias in

Disclosed is an optical signal distribution system. The system comprises an electronic substrate, at least one optical component and at least one optical waveguide on but distinct from the electronic substrate for carrying an optical signal to or from the optical component.

Optical signal distribution system

This invention relates to a ceramic module and to methods for forming protruding, upstanding electrically conducting pins by the selective abrasion of a surface 18 of a multilayered ceramic module 10. An abrasive blasting device 40 is disposed adjacent to the surface 18 for directing a stream of abrasive particles 42 against the surface. The particles 42 strike both metallic conductors 20 and 22 and also the ceramic material of the layer 14. Inasmuch as the ceramic material is relatively hard and brittle as compared to the ductile metallic conductors the abrasive particles 42 abrade away the ceramic layer 14 at a faster rate than the ductile metallic material of the conductors 20 and 22. The abrasive particles 42 may be comprised of any suitable abrasive, such as Al.sub.2 O.sub.3, SiC or WC. The module may be rotated beneath a nozzle of the grit blasting device, the nozzle being linearly translated above the surface being abraded.

Semiconductor device having metallic interconnects formed by grit

Formation of metallic interconnects by grit blasting

An apparatus for raising and supporting the foundation or slab of a building in which a lifting assembly is inserted underneath the foundation or slab and is adapted to receive a pipe assembly. A clamping assembly is provided for engaging a portion of the pipe assembly extending above the lifting assembly, and a hydraulic system extends between the lifting assembly and the clamping assembly for sequentially lowering the pipe assembly into the ground so that, when it encounters resistance, the foundation or slab is supported and can be raised to a predetermined level.

Apparatus for raising and supporting a building

A method is taught for repairing pinholes in dielectric layers and thereby avoiding metal shorts. The method is applied after the dielectric has been deposited on a base of conductive metallurgy and involves heating the metal-dielectric layers in an oxygen ambient and thereby oxidizing any exposed metal. The metal-oxide formed in the pinhole effectively insulates the underlying metal from a subsequently deposited metal; and, hence acts to prevent metal-to-metal shorts.

Method for providing pinhole free dielectric layers

Growing community of inventors

Poughkeepsie, NY, United States of America

Robert R Shaw