Temptronic Corporation

Palomar Medicaltechnologies, Inc.

Lytron, Inc.

Raytheon Company

Robert R Lopez

William M Stone

Gregory B Altshuler

Henry Zenzie

James G Burke, Iii

Christopher Gaal

Ilya Yaroslavsky

Andrei V Erofeev

Paul A Getchel

Kenneth M Cole, Sr

Henry A Lyden

Dana G Butcher

Thomas J Schey

James A Burke

Stephen B Kuznetsov

Anurag Gupta

Richard D Goldman

Shawn M Cousineau

Robert D Kelso

David W Voorhes

Henry H Zenzie

A high density capacitor comprises a housing having a cavity, and a plurality of capacitors forming at least one capacitor bank disposed in the housing cavity. A native cooling fluid is disposed in the cavity, and a heat exchanger is coupled to the housing. A pump is configured to circulate the native cooling fluid from the cavity, through the heat exchanger, through the spacings along an outer surface of each of the capacitors to cool the capacitors using forced convection. The heat exchanger is configured to communicate a secondary fluid through the heat exchanger and draw heat from the native cooling fluid flowing through the heat exchanger. The heat exchanger may have a plenum having a plurality of openings configured to dispense the native cooling fluid from the heat exchanger proximate the at least one capacitor bank.

Forced convection liquid cooling of fluid-filled high density pulsed power capacitor with native fluid

Methods and systems are disclosed for phototreatment in which replaceable containers comprising one or more adjuvant (consumable or re-useable) substances are employed. The adjuvant substance can be, for example, a topical substance or a coolant. Systems are disclosed for using a topical substance to detect contact of a phototreatment device with a tissue, detect speed of a phototreatment device over the tissue, detect regions of tissue that have been treated by a phototreatment device and/or to provide other benefits to the tissue such as improved skin tone and texture, tanning, etc. Safety systems are also disclosed that ensure that a proper consumable substance and/or container is connected to a phototreatment device and/or directed to a proper target. Additionally, cooling systems and methods that utilize phase change materials for extracting heat from a light generating device are disclosed.

Phototreatment device for use with coolants

Phototreatment device for use with coolants and topical substances

A workpiece chuck includes an upper assembly on which can be mounted a flat workpiece such as a semiconductor wafer. A lower assembly is mountable to a base that supports the chuck. A non-constraining attachment means such as vacuum, springs or resilient washers applied to the chuck holds the upper assembly to the lower assembly, the lower assembly to the base and can hold the wafer to the top surface of the upper assembly. By holding the chuck together by non-constraining means, the chuck layers can move continuously relative to each other under expansion forces caused by temperature effects, such that mechanical stresses on the chuck and resulting deformation of the chuck and workpiece over temperature are substantially eliminated. A plurality of support members including inclined surfaces provided between an upper and lower portion of the chuck maintain the top surface of the chuck and any workpiece mounted thereon at a constant height over temperature.

Method of manufacturing a workpiece chuck

A heat exchanger such as an evaporator for a temperature control system includes an input port with an orifice through which a refrigerant enters the heat exchanger. The heat exchanger includes a plurality of plates and a tilted deflection surface near the input port. High-pressure refrigerant entering through the input port impinges on the tilted deflection surface and is deflected by the deflection surface onto the plates. The tilt angle of the deflection surface is selected such that the refrigerant is evenly distributed over the plates resulting in even and highly efficient heat transfer. The heat exchanger can be used as the evaporator in a refrigeration system used to control temperature in a workpiece chuck for supporting a flat workpiece such as a semiconductor wafer during processing and testing. In particular, the heat exchanger can be used to control the temperature of a fluid which is circulated through the chuck to control the temperature of the workpiece and/or the chuck itself. In that setting, the temperature control circulating fluid can be circulated through the heat exchanger over the sides of the plates opposite the refrigerant to cool the circulating fluid. Because the refrigerant is evenly distributed over the plates, highly efficient heat transfer, i.e., cooling, is achieved.

Heat exchanger having sloped deflection surface for directing refrigerant

Workpiece chuck with guard layer having vacuum distribution pattern

Workpiece chuck

A heat exchanger comprises a cooling frame including first and second frame portions that releasably engage fin material. In one embodiment of the heat exchanger, first and second frame portions are movable with respect to each other. A fin module, which can include fragile or pliant fin material secured to a more robust strip of material, is positionable between the first and second frame portions. A tension device, such as a spring or a spacing controller, urges the frame portions together to bind the fin module between the frame portions. Releasing tension or urging the frame portions in an opposite direction releases the fin module. The fin module can also be retained within the cooling frame with one or more clips.

Heat exchanger

A heat sink is provided having a bundle of thermally conductive fibers that extend from a heat receiving end to a heat dissipating end where they are splayed as extremely numerous fins of one or plural coalesced fibers to enlarge the effective heat convecting area. The splayed fins are supported or maintained in a splayed array by a structure. Heat dissipation capability is augmented by forcing a cooling fluid such as air through the splayed fins. The fins are initially caused to separate or splay by various techniques including electrostatic spreading, layering, tape rolling, selective coating removal, and elastic rebound, and are maintained in the splayed position by a frame, adhesion, or elastomers.

Heat sink

Growing community of inventors

Boxford, MA, United States of America

Robert R Lopez