Mitsubishi Semiconductor America, Inc.

Mitsubishi Semiconuctor Americe, Inc.

Robert R Botts

Louis W Nicholls

Swati V Joshi

A method and apparatus for electroplating a workpiece to achieve a uniform plating thickness includes a cathode rack having a hook from which the workpiece is suspended and spaced apart from a consumable anode. The rack includes a plurality of plates made of the same material as the anode disposed on opposite sides of the rack. The plates direct a portion of the current emanating from the anode away from the workpiece to produce more uniform plating.

Method and apparatus for controlling plating thickness of a workpiece

A method and apparatus are provided for electroplating a workpiece. The apparatus includes an anode basket containing particles of an electroplating material. A mask is positioned around the anode basket to selectively block current flow from the basket to the workpiece which is mounted to a cathode. The mask includes a frame supporting a number of non-conductive plates adjusted in position to provide a desired electrical field distribution. The resulting electrical field between the anode and the cathode produces uniform plating thickness over the entire surface of the workpiece.

Method and apparatus using an anode basket for electroplating a workpiece

An anode basket containing anode particles used for electroplating a work piece. The anode basket includes baffles positioned inside the basket at selected locations. Hinges secure the baffles to opposing sidewalls of the basket and allow the baffles to pivot when sufficient manual force is applied to the respective hinges and/or baffle. The hinged baffles can be positioned to form separate compartments, enabling anode particles to be placed in different amounts at selected locations. If desired, some of the locations can have no anode particles. This permits more focused control of the metal ions.

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Durham, NC, United States of America

Robert R Botts