Intel Corporation

Apple Inc.

Robert R Atkinson

Tod A Byquist

Patrick S Johnson

Peter Wesley Bristol

David A Secker

Ralph V Miele

Ravindranath T Kollipara

Mahesh S Hardikar

Anthony P Valpiani

Ben M Broili

Michael S Brazel

Nicolas A Kurczewski

Stephen J Allen

Barry T Dale

Rajasekaran Swaminathan

Alanna M Koser

Kristin L Weihl

Stella Latscha

Alexander D Williams

The connector portion of a flex connector may be integrated into a socket, by forming a complete cutout in the socket in which the connector is located, or by forming the socket with a portion having a reduced thickness relative to the rest of the socket, with the connector being positioned in this portion of reduced thickness between the socket and an MLB. Another flex connector may be formed vertically above the first flex connector, mounted to the top surface of the package and clamped in place by a heat sink on top of the stack. Providing both top and bottom flex connectors may multiply the number of available connections for a given footprint. A heatsink positioned on top of the stack may include a spring assembly on a bottom portion to engage specified portions of the stack with a predefined force to ensure correct loading.

Socket with integrated flex connector

In one embodiment chassis for an electronic device comprises a first section and a second section and an assembly to connect the first section of the chassis to the second section of the chassis for an electronic device, comprising a first hinge assembly to be coupled to the first section of the chassis for the electronic device, a second hinge assembly to be coupled to the second section of the chassis for the electronic device, a first rigid connecting member to be coupled to the first hinge assembly and the second hinge assembly, a first resistance element to provide a first rotational resistance between the first hinge assembly and a first end of the first rigid connecting member and a first resistance element to provide a second rotational resistance between the second hinge assembly and a second end of the first rigid connecting member. Other embodiments may be described.

Hinge assembly

In one embodiment chassis for an electronic device comprises a first section and a second section and an assembly to connect a first section of the chassis to a second section of the chassis, comprising a hinge assembly to be coupled between the first section of the chassis and the second section of the chassis to allow rotation of the second section of the chassis with respect to the first section of the chassis, and a translation assembly to be coupled to the hinge assembly of the chassis for the electronic device to allow translation of the second section of the chassis with respect to the first section of the chassis, wherein rotation of the hinge assembly activates the translation assembly. Other embodiments may be described.

A computing device including fastening features. The computing device may include an upper shell comprising an upper boss protruding from the upper shell, the upper boss defining a cavity. The computing device may include a lower shell comprising a lower boss protruding from the lower shell. The computing device may include a threaded insert including an insert portion received at the cavity of the upper boss. The threaded insert may include a flange portion wider than the insert portion, and a lateral movement reduction feature. The computing device may include a fastener received through the lower boss and through the threaded insert to fasten the upper shell and lower shell to each other.

Fastening techniques for electronic devices

Embodiments of the present invention describe a bare die package and its methods of fabrication. The bare die package comprises a die electrically coupled to a package substrate, and a displacement constraint. In an embodiment of the present invention, the displacement constraint is a plurality of members fixedly attached onto the package substrate and surrounds the die. When the bare die package is secured between a socket and a heat sink, the plurality of members provide structural support to the package substrate and prevent excessive substrate warpage.

Bare die package with displacement constraint

A heat sink may be clamped to a thermoelectric cooler and vapor chamber using a U-shaped retention band. The band may attach underneath the vapor chamber, extending around the thermoelectric cooler, and over a heat sink. The heat sink may include a plate to distribute the force of the band across the heat sink. Bolts may be utilized to transfer the force from the free ends of the U-shaped retention band to a vapor chamber support frame. Thus, in some embodiments of the present invention, a thermoelectric cooler may be clamped to a heat sink without wasting heat transfer area through the use of bolts, without unnecessary bending, and without requiring a relatively thick base on the heat sink.

Thermoelectrically cooling electronic devices

A heat sink assembly may be plugged into a receiving element in a printed circuit board. A retention element includes upper and lower portions. The lower portion may be plug locked onto a printed circuit board. The upper portion then telescopes into and releaseably locks in the lower portion. The upper portion may include a rod which may be rotated to free the upper portion from the lower portion for disassembly.

Growing community of inventors

Chandler, AZ, United States of America

Robert R Atkinson