Growing community of inventors

Goleta, CA, United States of America

Robert Proebstel

Average Co-Inventor Count = 20.00

ph-index = 1

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 0

Robert ProebstelNicholas Högasten (1 patent)Robert ProebstelTheodore R Hoelter (1 patent)Robert ProebstelKatrin Strandemar (1 patent)Robert ProebstelPierre M Boulanger (1 patent)Robert ProebstelAustin A Richards (1 patent)Robert ProebstelJeremy P Walker (1 patent)Robert ProebstelGiovanni Lepore (1 patent)Robert ProebstelJohn C Day (1 patent)Robert ProebstelLouis Tremblay (1 patent)Robert ProebstelDylan M Rodriguez (1 patent)Robert ProebstelJustin Muncaster (1 patent)Robert ProebstelHugo Hedberg (1 patent)Robert ProebstelJames Klingshirn (1 patent)Robert ProebstelKarl Rydqvist (1 patent)Robert ProebstelEugene Pochapsky (1 patent)Robert ProebstelFredrik Gihl (1 patent)Robert ProebstelRasmus Loman (1 patent)Robert ProebstelTien Nguyen (1 patent)Robert ProebstelRobert Proebstel (1 patent)Nicholas HögastenNicholas Högasten (87 patents)Theodore R HoelterTheodore R Hoelter (75 patents)Katrin StrandemarKatrin Strandemar (74 patents)Pierre M BoulangerPierre M Boulanger (58 patents)Austin A RichardsAustin A Richards (30 patents)Jeremy P WalkerJeremy P Walker (13 patents)Giovanni LeporeGiovanni Lepore (10 patents)John C DayJohn C Day (4 patents)Louis TremblayLouis Tremblay (4 patents)Dylan M RodriguezDylan M Rodriguez (3 patents)Justin MuncasterJustin Muncaster (2 patents)Hugo HedbergHugo Hedberg (2 patents)James KlingshirnJames Klingshirn (2 patents)Karl RydqvistKarl Rydqvist (1 patent)Eugene PochapskyEugene Pochapsky (1 patent)Fredrik GihlFredrik Gihl (1 patent)Rasmus LomanRasmus Loman (1 patent)Tien NguyenTien Nguyen (1 patent)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Teledyne Flir, LLC (1 from 15 patents)


1 patent:

1. 12400452 - Non-contact temperature measurement in thermal imaging systems and methods

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12/26/2025
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