International Business Machines Corporation

Robert P Rippstein

Alexander L Flamholz

Doris P Pulaski

Peter H Berasi

Michael F Jerome

Chester A Wasik

Russell W Boehm

Matthew A Thompson

Jerome Paul Silverman

Yuli Vladimirsky

David R Stone

Disclosed is a method of manufacturing a metal mask for an integrated circuit chip interconnect solder bump. The invention deposits a very thick photoresist on both sides of a very thick molybdenum foil sheet (the molybdenum sheet is at least 8 mils thick and the photoresist is at least 5 microns thick). Then the process exposes and develops the photoresist to produce at least one opening having a diameter of at least 5 mil. The invention simultaneously etches both sides of the molybdenum foil using a very low etchant spray pressure of approximately 5 psi to form at least one via in the molybdenum foil that has a diameter of at least 12 mil and a knife-edge of 0.2 mil. The photoresist is removed after the etching process.

Moly mask construction and process

A method of making, and the resultant mask, comprises developing resist layers over surfaces of a masking layer to transfer significantly reduced sized openings within glass masters attached to the surfaces of the masking layer into the resist layers. These significantly reduced sized openings within the resist layers are then transferred into the masking layer within a first etch bath by simultaneously monitoring and controlling both etchant activity and concentration of a byproduct within the etch bath formed between the masking material and the etchant. The openings may be etched to completion within the first etch bath, or alternatively, the openings may be etched to a pre-finished image size. Wherein the openings are etched to a pre-finished image size, the masking layer is immersed into a second etch bath for further micro-etching of these openings to a final desired image size.

Fine-dimension masks and related processes

A x-ray scanning method involves the stops of directing an x-ray beam at a collimating first mirror having the capability of altering the source to mirror location and/or grazing angle of incidence. The beam is then reflected from a flat second mirror capable of a scanning motion by linear translation with an optional accompanying angular change in the grazing angle of incidence of the beam on the second mirror.

X-ray beam scanning method for producing low distortion or constant

An x-ray lithography mask design provides for replacement of a single large area membrane with a set of smaller membranes (segments) fabricated on a single mask substrate forming a segmented mask. The segments are arranged serially so that they can be sequentially aligned and exposed by a shaped x-ray beam. Thus, the segmented mask is a series of mask membrane segments mounted together.

Segmented mask and exposure system for x-ray lithography

Sensor arranged to detect the proper placement and quantity of one or more inserts in the cavity of an injection molding machine. The sensor is preferably formed of a spring-biased plunger through one of the cavity shells. A photodetector monitors the movement of the plunger as the cavity-forming shells are closed and activates an alarm signal if the plunger movement is excessive before detection of proper mold closure.

Growing community of inventors

Hopewell Junction, NY, United States of America

Robert P Rippstein