International Business Machines Corporation

Robert P Kuder, Ii

James L Speidell

Michael A Gaynes

Sri Muthuthamby Sri-Jayantha

Jeffrey Donald Gelorme

David L Questad

Frank Louis Pompeo

Thomas Edward Lombardi

Son K Tran

Marie-Claude Paquet

Daniel J Littrell

David C Linnell

Robert P Westerfield, Jr

Robert Albert Meyen

Thomas Gerard Jantz

Evan G Colgan

Jae-Woong Nah

Bucknell Chapman Webb

Govindarajan Natarajan

Francis R Krug, Jr

Jin J Wu

William A Cavaliere

Edward James Pega

A method and apparatus for bonding a processor wafer with a microchannel wafer/glass manifold to form a bonded wafer structure are provided. A glass fixture is also provided for protecting C4 solder bumps on chips disposed on the processor wafer. When the glass fixture is positioned on the processor wafer, posts extending from the glass fixture contact corresponding regions on the processor wafer devoid of C4 solder bumps, so that the glass fixture protects the C4 solder bumps during wafer bonding. The method involves positioning the processor wafer/glass fixture and the microchannel wafer/glass manifold in a metal fixture having one or more alignment structures adapted to engage corresponding alignment elements formed in the processor wafer, glass fixture and/or glass manifold. The metal fixture secures the wafer components in place and, after melting solder pellets disposed between the processor wafer/glass fixture and microchannel wafer/glass manifold, a bonded wafer structure is formed.

Method and apparatus of processor wafer bonding for wafer-scale integrated supercomputer

An interconnect structure that includes a component circuit board containing a plurality of electrical components, and a wafer connector assembly. The wafer connector assembly includes a plurality of interconnect circuit boards that are in electrical connection with the components circuit board through a plurality of rows of solder joints, the plurality of interconnect circuit boards having a connection end including at least one contact. An adhesive is present structurally reinforcing at least a row of the solder joints that is proximate to the connection end of the plurality of interconnect circuit boards of the wafer assembly.

Method and apparatus for strain relieving surface mount attached connectors

A process and apparatus are provided for preparing a release layer suitable for facilitating release of green ceramic laminates from a lamination fixture. The process comprises applying an electrostatic charge to at least one variably electrostatically chargeable portion of at least one lamination fixture and dispensing a layer of ceramic particulates, glass particulates or glass-ceramic particulates onto the charged portion of the lamination fixture to form a release layer on the lamination fixture. The apparatus provides a particulate dispenser for dispensing a layer of particulates of ceramic, glass, or ceramic-glass mixture, at least one lamination fixture having at least one variably electrostatically chargeable portion disposed in particulate receiving communication with the particulate dispenser; and a variable voltage electrostatic generator in electrical communication with the at least one chargeable portion of the lamination fixture.

Method and apparatus for preparing a release layer of ceramic particulates

An apparatus for loading, chamfering and unloading a ceramic or ceramic/polymer substrate for electronic components. An automatic part loader moves substrates in a row as a unit, using a frangible pin to push the parts. The part loader separates the first of the substrates from the rest, and a load pedestal pushes the first substrate up into a loading/unloading nest. The load pedestal is mounted on rods so that the substrate may move laterally to center itself in the nest. The nest then rotates to load the substrate onto a movable process pedestal. The chamfering apparatus includes a pair of spaced, rotatable cutting spindles for chamfering edges and corners on the substrate. The cutting spindles include: i) separate top and bottom edge cutters for simultaneously chamfering top and bottom of edges of a substrate secured on the carrier as the substrate passes between the spindles and ii) corner cutters for simultaneously chamfering corners of a substrate secured on the carrier as the substrate contacts the spindles. The pedestal rotates the substrate about an axis normal to the plane of the substrate and moves the substrate in a direction normal to the plane of the substrate to present unchamfered edges and corners to the cutting spindles. A disc brake on the process pedestal may be actuated to prevent rotation of the substrate during chamfering. An enclosure surrounds the substrate, chamfering cutters and process pedestal during chamfering and utilizes the air flow supplied by the rotating cutters to propel chips into a particle collector.

Automated chamfering method

Automated chamfering apparatus and method

An apparatus for mounting to a tool having a surface to be cleaned for producing aerosol from a substance for cleaning the surface, includes a flange for mounting to the tool having the surface to be cleaned. A nozzle is mounted to the flange for receiving the substance. The nozzle has at least one exit opening which allows passing of the substance therethrough for expanding the substance from a first pressure to a second pressure which is lower than the first pressure for solidifying at least a substantial portion of the substance and producing aerosol for cleaning the surface. Condensation preventing means is provided for preventing condensation from forming on surfaces of the apparatus and the surface to be cleaned, and contamination preventing means is provided for preventing contaminants from re-contaminating the surface subsequent to removal therefrom.

Mounting apparatus for cryogenic aerosol cleaning

Growing community of inventors

Hopewell Junction, NY, United States of America

Robert P Kuder, Ii