Lam Research Corporation

Btu International, Inc.

Aventa Technologies, Inc.

Robert P Couilliard

Piero Sferlazzo

Aseem Kumar Srivastava

Arthur Waugh

Francis C Nutter

Darren M Simonelli

Martin I Soderlund

Pierre J LeMieux

Dennis R Stucky

Matthew C Farrell

Paul Thomas Fabiano

A showerhead apparatus for a linear batch CVD system includes a movable showerhead, one or more gas supply conduits, and a translation mechanism. Each gas supply conduit provides a precursor gas to the showerhead. The showerhead includes conduits and channels arranged along the length of the showerhead to distribute precursor gas to the surfaces of substrates. The small distance between the substrates and the showerhead limits precursor gas flows from the channels to a small portion of each substrate beneath the showerhead. During a deposition process run, the translation mechanism causes the showerhead to move back and forth over the substrates along a direction perpendicular to a linear arrangement of the substrates. Parasitic deposition within the deposition chamber is substantially reduced in comparison to conventional showerhead apparatus. The ability to accurately control the precursor gas flows and the motion of the showerhead allows for improved thickness uniformity and device yield.

Showerhead apparatus for a linear batch chemical vapor deposition system

A continuously variable microwave circuit capable of being tuned to operate under a plurality of distinct operating conditions, comprising: a waveguide comprising an adjustable tuning element having a core configured to protrude into the waveguide; an actuator in operative communication with the adjustable tuning element, wherein the actuator is operable to selectively vary a length of the core that is protruding into the waveguide so as to minimize reflected microwave power in the plasma asher; and a controller in operative communication with the actuator, wherein the controller is configured to selectively activate the actuator upon a change in the plurality of operating conditions.

Tuning hardware for plasma ashing apparatus and methods of use thereof

A solder reflow convection furnace employing flux collection and heating to minimize flux and solvent build up and gas densification to reduce input gas flow is disclosed. As solder melts in the furnace, an effluent of vaporized flux is driven off and can condense on cooler components. To minimize such condensation, the gas is directed through a cooling system in which the flux condenses, and the cooled, cleaned gas is directed into the furnace's product cooling section. In another embodiment, in which the gas in the furnace is recirculated, a cooling coil is located upstream of the recirculating gas mover to heat the primary gas. The vaporized flux condenses on the cooling coil, which can be readily removed and replaced. In another aspect of the invention, when the furnace employs a gas amplifier, the recirculating gas is cooled prior to reentry into the heating chamber, which increases its density and removes flux by condensation. Upon reentering the heating chamber, the cooler, denser gas undergoes a greater expansion than would return hot gas, thereby increasing the pressure in the chamber and correspondingly increasing the velocity of the output flow to the process area. The increased velocity allows reduction of consumption of the primary gas and increases the efficiency of heat transfer.

Solder reflow convection furnace employing flux handling and gas

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Plaistow, NH, United States of America

Robert P Couilliard