Rockwell Collins, Inc.

Robert P Campbell

David W Cripe

Ryan Legge

Bryan S McCoy

Gerard A Woychik

James B Mayfield

Jeffrey J Deloy

John A Bauer

A system of circuit card components each include through-holes for soldering having recessed copper layers for thermal insulation. Thermal insulation prevents heat conduction away from flowing solder, allowing the solder to flow freely through the through-hole. Even high-temperature, lead-free solders may maintain the necessary temperature to flow. Different circuit layers include specialized features based on distance from a top or bottom surface. Vias surrounding the through-hole maintain the necessary cross-sectional area for electrical connectivity.

Through-hole and surface mount printed circuit card connections for improved power component soldering

An actuator includes a shape memory element formed from a shape memory alloy. The shape memory element is configured such that the actuator is actuated by a change in shape of the shape memory element. The shape memory element may be maintained in a pre-actuated state that is advanced from its rest state, but which is not at its actuated state.

Shape-memory alloy actuator

A shape memory element (a structure formed from a shape memory alloy) includes an electrically conductive ferromagnetic material. The ferromagnetic material may be magnetostrictive. In some embodiments, the shape memory element is formed from a shape memory alloy core and has a cladding over the core that includes the ferromagnetic material. In other embodiments, the shape memory alloy may be selected to be ferromagnetic.

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Marion, IA, United States of America

Robert P Campbell